Info
Info
News Article

Collaboration Sparks Sustainable Electronics Manufacturing Breakthrough

News

SFU Mechatronic Systems Engineering professor Woo Soo Kim is collaborating with Swiss researchers to develop an eco-friendly 3D-printable solution for producing wireless Internet of Things sensors.

Simon Fraser University and Swiss researchers are developing an eco-friendly, 3D printable solution for producing wireless Internet-of-Things (IoT) sensors that can be used and disposed of without contaminating the environment. Their research has been published as the cover story in the February issue of the journal Advanced Electronic Materials.

SFU professor Woo Soo Kim is leading the research team's discovery involving the use of a wood-derived cellulose material to replace the plastics and polymeric materials currently used in electronics. Additionally, 3D printing can give flexibility to add or embed functions onto 3D shapes or textiles, creating greater functionality.

“Our eco-friendly 3D printed cellulose sensors can wirelessly transmit data during their life, and then can be disposed without concern of environmental contamination,” says Kim, a professor in the School of Mechatronic Systems Engineering. The SFU research is being carried out at PowerTech Labs in Surrey, which houses several state-of-the-art 3D printers used to advance the research.

“This development will help to advance green electronics. For example, the waste from printed circuit boards is a hazardous source of contamination to the environment. If we are able to change the plastics in PCB to cellulose composite materials, recycling of metal components on the board could be collected in a much easier way.”

Kim's research program spans two international collaborative projects, including the latest focusing on the eco-friendly cellulose material-based chemical sensors with collaborators from the Swiss Federal Laboratories for Materials Science.

He is also collaborating with a team of South Korean researchers from the Daegu Gyeongbuk Institute of Science and Technology's (DGIST)'s department of Robotics Engineering, and PROTEM Co Inc, a technology-based company, for the development of printable conductive ink materials.

In this second project, researchers have developed a new breakthrough in the embossing process technology, one that can freely imprint fine circuit patterns on flexible polymer substrate, a necessary component of electronic products.

Embossing technology is applied for the mass imprinting of precise patterns at a low unit cost. However, Kim says it can only imprint circuit patterns that are imprinted beforehand on the pattern stamp, and the entire, costly stamp must be changed to put in different patterns.

The team succeeded in developing a precise location control system that can imprint patterns directly resulting in a new process technology. The result will have widespread implications for use in semiconductor processes, wearable devices and the display industry.

Kim was selected as a Brain Pool Fellow by the National Research Foundation (NRF) of Korea.

An expert in 3D printed electronics who heads SFU's Additive Manufacturing Laboratory, he spent six months collaborating with researchers at Seoul National University to advance fabrication of thin film transistors using 3D printing technology.



AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FREE

VIEW ON-DEMAND
OmniVision Announces Industry’s First 8 Megapixel Medical-Grade Image Sensors For Single-Use And Reusable Endoscopes
Luvata Announces €34M Investment In Finland Hot Extrusion Line
SiTime MEMS Oscillators Support Square Point-of-Sale Products
CleanSurF - AP&S New Cleanliness Guarantor For Carriers, Boxes, SMIFs And FOUPs
Xenics Introduces CERES T 640
Nordson Ships First SELECT Unit From New Global Manufacturing Facility
Winbond’s Successful Interoperability Of OctalNAND Flash With Synopsys DesignWare AMBA IP
ASM AMICRA Unveils Three New Manufacturing Systems
FormFactor Introduces Automated Cryogenic Wafer Probe System
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
Brewer Science Achieves ISO 45001:2018
SiTime MEMS Timing Solution To Support Raytheon’s Precision Guidance System
Blaize Announces $71 Million Series D Financing
Park Systems Announces Autonomous AFM With Built-in Intelligence
Renesas And Syntiant Develop Voice-Controlled Multimodal AI Solution
Semiconductor IP Market To Reach USD $7 Billion By 2027
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
TESCAN New Delayering Capability For Unattended, Automated Failure Analysis
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
Picosun’s PicoArmour Reduces Semiconductor Manufacturing Costs
Picosun Strengthens Its Presence In Southeast Asia
Brewer Science Recognized As Certified B Corporation
5G Is A Game-Changer For Semiconductors
EV Group Launches First Step And Repeat Mastering Services For Nanoimprint Lithography

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event