News Article

CEA-Leti And UnitySC To Fuel Industry 4.0 With Smarter Tools

News

Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools' footprint and cost of ownership.

CEA-Leti and UnitySC have been working on the development of a metrology-inspection platform for the past four years. The initial targeted applications were 3D integration modules, specialty bonding, and CMP. So far, the collaboration has helped advance UnitySC's system from a tabletop tool to a fully automated 200-300 mm Swiss Army knife-like platform that has shown very good performance during the validation phase. Today, UnitySC and CEA-Leti extend this collaboration to finalize the improvement of the platform and enhance its application space.

The extended collaboration also will address smarter tools for Industry 4.0. CEA-Leti and UnitySC will specifically work towards improving the platform's ease of use and reliability, enhancing the multi-sensor approach of today's tools, and bringing intelligence to the platform by adding innovative artificial intelligence (AI) approaches.This new generation of the platform, announced during SEMICON West, will allow users to tackle several control problems on different applications. These include buried interface defects on Si and GaN, and SiC edge defectivity control, as well as etch and roughness, bonded wafers and chip-to-wafer alignment, among others.

Xenics Introduces Ceres V
Imec And Bühler Enable High-throughput Manufacturing Of Filter-on-chip CMOS Sensors
Advantest Rolls Out ACS Adaptive Probe Cleaning
Infineon Revenue Up In Q2 FY 2022
ASML Bring E-beam Inspection Into Volume Manufacturing
Imec Ramps Up Development Of High-NA EUV Patterning Ecosystem
ClassOne Equipment Introduces New Takano Particle Inspection Systems
Okmetic Invests Nearly €400 Million Euros To Build A New Fab In Finland With Aims To More Than Double The Production Capacity And Business
ClassOne Equipment Selected To Represent Takano
“Onshoring” Chip Production Is A Red Herring For UK
Renesas To Invest And Restart Operation Of Kofu Factory
X-FAB Announces Upgrade To Its Substrate Coupling Analysis Tool
Critical Manufacturing Releases The V9 Of Its MES: Master Manufacturing In Extreme Uncertainty
2D Experimental Pilot Line Offers Developers The Chance To Test Graphene-based Sensors
SEMI Report: Silicon Wafer Shipments Edge To New Record In Q1 2022
ClassOne Ships Solstice Tool To MicroLED Startup Raxium
Electronics Supply Chain Challenges Are Getting Worse
Pfeiffer Vacuum Opens New Leak Detection And Vacuum Technology Facility In Indianapolis, Indiana
Teradyne Marks 7,000th J750 Semiconductor Test System Shipment
Advantest Donates ¥90 Million To Ukraine Crisis Relief Efforts
PEM Water Electrolysis Fills The Hydrogen Supply Gap For New And Expanding Fabs
Applied Materials Enable 2D Scaling With EUV And 3D Gate-All-Around Transistors
Atotech And Schweitzer Engineering Laboratories Announce Business Partnership
Brewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award

{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
X
Live Event