Info
Info
News Article

CEA-LETI And Partners Demonstrate Potentially Scalable Quantum Dots

Leti, a technology research institute of CEA Tech, and its research partners have demonstrated a potentially scalable readout technique that could be fast enough for high-fidelity measurements in large arrays of quantum dots.

In a paper presented at IEDM 2019, the international research team reported its work on developing a toolkit on a SOI MOSFET-based prototyping platform that enables fast reading of the states of charge and spin. The study explored two gate-based reflectometry readout systems for probing charge and spin states in linear arrangements of MOS split-gate-defined arrays of quantum dots. The first system gives the exact number of charges entering the array and can help to initialize it. It can also read spin states, albeit in relatively small arrays. The second one gives the spin state in any quantum dot regardless of the array length but is not useful for tracking charge number. Both readout schemes can be used complementarily in large arrays.

The study's findings “bear significance for fast, high-fidelity, single-shot readout of large arrays of foundry-compatible silicon MOS spin qubits,” the paper notes.

“The short-term efforts for our team going forward will be a joint optimization to increase speed and reliability of the readouts,” said CEA-Leti's Louis Hutin, lead author on the paper. “The longer-term goal is to transfer this know-how on a larger scale and to less conventional architectures, featuring an optimized topology for error correction.”

Reflectometry is a technique that leverages signal reflections along a conducting line when an incident RF wave meets an impedance discontinuity. In CEA-Leti's study, the probing line was connected to the MOS gate of a silicon quantum dot. The system was prepared so that the load impedance depends on the spin state of the qubit, which enabled the team to monitor single spin events non-destructively and almost as they occurred.

In addition to CEA-Leti, the research team includes CNRS Institut Néel and CEA-IRIG, Grenoble, France; the Niels Bohr Institute, University of Copenhagen, Denmark; and Hitachi Cambridge Laboratory and Cavendish Laboratory, University of Cambridge, UK. Their paper is titled “Gate Reflectometry for Probing Charge and Spin States in Linear Si MOS Split-Gate Arrays”.



AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FREE

VIEW ON-DEMAND
Blaize Announces $71 Million Series D Financing
Brewer Science Achieves ISO 45001:2018
Nordson Ships First SELECT Unit From New Global Manufacturing Facility
FormFactor Introduces Automated Cryogenic Wafer Probe System
SiTime MEMS Oscillators Support Square Point-of-Sale Products
Winbond’s Successful Interoperability Of OctalNAND Flash With Synopsys DesignWare AMBA IP
OmniVision Announces Industry’s First 8 Megapixel Medical-Grade Image Sensors For Single-Use And Reusable Endoscopes
Park Systems Announces Autonomous AFM With Built-in Intelligence
Picosun’s PicoArmour Reduces Semiconductor Manufacturing Costs
SiTime MEMS Timing Solution To Support Raytheon’s Precision Guidance System
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
Luvata Announces €34M Investment In Finland Hot Extrusion Line
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
ASM AMICRA Unveils Three New Manufacturing Systems
5G Is A Game-Changer For Semiconductors
CleanSurF - AP&S New Cleanliness Guarantor For Carriers, Boxes, SMIFs And FOUPs
TESCAN New Delayering Capability For Unattended, Automated Failure Analysis
Brewer Science Recognized As Certified B Corporation
Renesas And Syntiant Develop Voice-Controlled Multimodal AI Solution
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
EV Group Launches First Step And Repeat Mastering Services For Nanoimprint Lithography
Picosun Strengthens Its Presence In Southeast Asia
Semiconductor IP Market To Reach USD $7 Billion By 2027
Xenics Introduces CERES T 640

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event