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Kenneth Hörhammer Joins Picosun As Vice President, Sales

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AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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VIEW ON-DEMAND
ASM AMICRA Unveils Three New Manufacturing Systems
Institute Microelectronics And Photonics Chooses Tektronix For Semiconductor Testing At Very Low Currents
Renault To Create Better Brand Visibility For Qualcomm In EV Market
Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System
Sivers Semiconductors’ Japanese Customer Takes Step Towards Mass Production
Picosun Strengthens Its Position In The Semiconductor Market
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
Path To Sensors Interoperability - IEEE SA Sensors Series Live Webinar
Winbond’s Successful Interoperability Of OctalNAND Flash With Synopsys DesignWare AMBA IP
DISCO Corporation's Completion Of Construction At Kuwabata Plant
Linton Crystal Technologies Uses AI To Detect Crystal Structure Loss, Notify Operator
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
Renesas And Syntiant Develop Voice-Controlled Multimodal AI Solution
Pfeiffer Vacuum Introduces The Reliable And Low-vibration HiPace 80 Neo Turbopump
ACM Research Enters Bevel Etch Market To Support Emerging Process Steps In 3D NAND, DRAM And Advanced Logic Manufacturing
Edwards Opens Lab At Hillsboro Innovation Center
Edwards Officially Opens New Flagship Service Technology Centre In Dublin
Tignis Simplifies Adding ML To Advanced Process Control Manufacturing Systems
Blaize Announces $71 Million Series D Financing
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
Pfeiffer Vacuum Presents A Cloud-based Solution For Service Management
Xenics Expands Its Bobcat Product Family And Makes SWIR Cameras Affordable.
PragmatIC Semiconductor Re-invents Iconic Processor
SiTime MEMS Oscillators Support Square Point-of-Sale Products

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