Info
Info
News Article

Reno Launches Series Of Integrated RF Power Systems At 7nm Or Below

News

Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for nanoscale semiconductor manufacturing, has introduced its new GenMatch Series that integrates the company's proven solid-state Electronic Variable Capacitor (EVC) RF match and Precis generator technologies into a single unit. The systems have a footprint similar to a match alone, saving space on the process tool, and are faster, more repeatable and more reliable, with lower cost of ownership. GenMatch systems are ideal for leading-edge etch and deposition applications in semiconductor manufacturing, where level-to-level pulsing and short RF on-times are critical to meet performance requirements at the most advanced nodes.

“Reno has a strong track record of bringing novel RF match technology to market, and the GenMatch™ is no exception,” said John Voltz, senior vice president of business development at Reno. “The high reliability of our EVC all-solid-state match equals RF generator reliability, making it now economical to put both in the same package. The GenMatch is a true RF power system that delivers plug-and-play performance, a first for plasma processing in advanced semiconductor manufacturing.”

The GenMatch platform covers powers from 500W to 10kW and frequencies from 400kHz to 60MHz. The generator supports level-to-level pulsing, while the RF matching network matches impedance on each pulse, meaning every wafer sees the same frequency, unlike frequency sweep. AI and machine learning using the matching network's extensive sensor and sampling capability further enhance system performance.

Benefits offered by the GenMatch Series include:

• Detection of fast transients at the output of the RF matching network. These transients may represent micro-arcing in the plasma chamber that the etch or deposition tool would never identify. Reno's RF generator can then control the power to the chamber to eliminate the micro-arcing.

• The option to fully tune the plasma impedance, compared to standard frequency tuning approaches that can only tune limited plasma impedances, and then only the reactive part of the plasma impedance.

• The ability to provide additional tuning options, such as sequential tuning, where the frequency tuning and EVCTM tuning are done sequentially for faster, repeatable and more stable tuning of the plasma impedance.

• The generator can be set to sweep the frequency to tune the reactive portion of the plasma impedance, for which the EVCTM-based matching network adjusts the capacitance values to tune the resistive portion of the plasma impedance.

• Proprietary, dual-stage heterodyne circuitry that enables a faster slew rate response from the detector stages of the control circuit. This provides a considerably more accurate measurement of pulsed RF signals.

With match and generator about the same size as Reno match alone, the combined unit saves valuable space on the process tool. Additional cost savings are achieved, as only one location is required to facilitize power, water, etc. All-digital units allow for multiple communication protocols, Ethernet, EtherCAT and DeviceNet.



AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FREE

VIEW ON-DEMAND
Picosun’s PicoArmour Reduces Semiconductor Manufacturing Costs
SiTime MEMS Timing Solution To Support Raytheon’s Precision Guidance System
SiTime MEMS Oscillators Support Square Point-of-Sale Products
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
Semiconductor IP Market To Reach USD $7 Billion By 2027
Brewer Science Achieves ISO 45001:2018
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
EV Group Launches First Step And Repeat Mastering Services For Nanoimprint Lithography
OmniVision Announces Industry’s First 8 Megapixel Medical-Grade Image Sensors For Single-Use And Reusable Endoscopes
5G Is A Game-Changer For Semiconductors
Xenics Introduces CERES T 640
Blaize Announces $71 Million Series D Financing
Park Systems Announces Autonomous AFM With Built-in Intelligence
ASM AMICRA Unveils Three New Manufacturing Systems
Luvata Announces €34M Investment In Finland Hot Extrusion Line
TESCAN New Delayering Capability For Unattended, Automated Failure Analysis
Winbond’s Successful Interoperability Of OctalNAND Flash With Synopsys DesignWare AMBA IP
CleanSurF - AP&S New Cleanliness Guarantor For Carriers, Boxes, SMIFs And FOUPs
FormFactor Introduces Automated Cryogenic Wafer Probe System
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
Brewer Science Recognized As Certified B Corporation
Nordson Ships First SELECT Unit From New Global Manufacturing Facility
Renesas And Syntiant Develop Voice-Controlled Multimodal AI Solution
Picosun Strengthens Its Presence In Southeast Asia

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event