News Article

Merck Launches Semiconductor Materials Webinar Series


On October 26th,Industry professionals tuned in to hear the first webinar on Advanced Materials: The Dark Horse in the Semiconductor Chipmaking Race?

Endorsed by SEMI , this is the FIRST live webinar in a series of webinars to explore pressing topics on materials and semiconductor development.

This webcast has now been completed - but you are welcome to watch it On Demand - simply click on this url to view the entire webcast.

Participants learned how to best introduce new materials in chip fabrication workflows as the demand for better performance, functionality, and reliability grows for applications such as 5G, AI, VR, AR, edge computing, etc.

Merck subject matter experts discussed opportunities, challenges, and best practices in transitioning to novel process architectures and the new materials considerations for successful deployments.

Discussion topics included:

· Exploring the exciting developments in back-end-of-the-line interconnect technology.

· Transitioning from the established copper/low-k dual-damascene approach to novel metallization (such as Ru, Mo, Co, etc.), and new process integration schemes.

· Offering integrated additive (i.e., deposition) and subtractive (etch and CMP) process modules that meet aggressive KPI targets for accelerating semiconductor technology development.

Welcome remarks by

· Anand Nambiar, Global Head of Semiconductor Materials, Merck

Moderation by

Laith Altimime, President, SEMI Europe

Milind Weling

Senior VP and Head of Programs and Operations



Senior Program Manager

Vidyut Gopal

Registration is FREE.

If you can't attend the live session,

register for On-demand content.

View complete Agenda and Learn about the Speakers

YES Partners With Osiris For Edge Film Removal Technology
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
Park Systems Combines AFM With White Light Interferometry
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CEA-Leti Unveils Navigation-Grade Gyroscopes
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Edwards Launches New Cryopump
NTU Singapore Launches Quantum Science And Engineering Centre
ClassOne Appoints Industry Veteran Ken Gibbons
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
ULVAC Expands Process Capability
Mycronic Receives Order For An SLX Mask Writer
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
The All-round Smart Proximity Sensor Chip
ALD Is Taking Off In More-than-Moore Applications
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
BASF And Entegris Sign Agreement On Sale
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time

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