News Article

CEA-Leti Unveils Navigation-Grade Gyroscopes


CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano have developed the world's smallest-footprint MEMS gyroscope that can provide navigation-grade performance. The researchers were able to meet these specifications with a sensor footprint of only 1.3 mm2 by leveraging nano-resistive sensing.

Low-power MEMS gyroscopes are now ubiquitous in everyday objects. They monitor and control device position, orientation, direction, angular motion and rotation. With the growing development of driver-assist systems and other automated functions, the need for improved performance and robustness has increased significantly, fueled by the demand for miniaturization and cost control for real inertial navigation systems.

To address new demands for high-performance inertial measurement units (IMU), these gyroscopes must reach the navigation grade, which means improved characteristics of one or two orders of magnitude compared to the best commercial MEMS gyroscopes. Thus, they require a bias instability well below 0.1°/h and an angular random walk (ARW) of less than 0.01°/√h.

CEA-Leti, in collaboration with Politecnico di Milano, reached these targets by demonstrating performance matching the best state of the art on ultra-miniaturized MEMS gyroscopes. The results were reported in a paper, “1.3 mm2 Nav-Grade NEMS-Based Gyroscope”, in the Journal of Microelectromechanical Systems.

“This improved performance must not come with a high cost so the device will be priced competitively in large-volume markets, such as the automotive and consumer markets,” said Philippe Robert, MEMS business development manager and senior expert at CEA-Leti. “The size of these new gyroscopes must therefore not exceed 2 mm² per axis, while maintaining standard MEMS technology and using wafer-level vacuum packaging.”

Combining CEA-Leti's expertise in highly sensitive sensors based on silicon nano-gauges and Politecnico di Milano's expertise in gyroscope design, this new gyroscope solution reaches “0.004 °/ √hr ARW and 0.02 °/hr stability on average over several tested samples, unrivalled results for a 1.3 mm²-size gyroscope footprint”, the paper reported. The ARW and bias instability performance were highlighted on non-static operations: "After 9-minute long in-operation navigation where the gyro is repeatedly tilted by 180° constant angle rotations and by AC random motion with about 200-dps peak-to-peak value, the residual angle error at the end of navigation corresponds to only 0.07°." This result was achieved without Kalman filter compensation.

To keep manufacturing costs low, the team focused on both the sensor's size and the robustness of the fabrication process, especially on vacuum-WLP. The CEA-Leti and Politecnico di Milano NEMS-based gyroscope is fully compatible with standard MEMS foundries for high-volume markets such as the automotive industry. They also are working on 3-axis gyroscope co-integration, whose feasibility has already been demonstrated, but where the objective will be to bring the same level of performance according to the three axes. In addition, to address a wide range of applications (short-term navigation in a GPS outage, indoor navigation, platform stabilization, accurate robotic motion control for Industry 4.0, guided munitions, etc.), the team ensured a resonant frequency greater than 25 kHz to withstand conventional vibration environments.

Top-view image of the gyroscope with false colors highlighting the drive and Coriolis frames and the corresponding decoupling levers

“This architecture enables best-in-class MEMS gyroscopes in terms of overall performance, size and resonant frequency, and our breakthrough 1.3 mm² high-frequency device is already at the state-of-the-art performance in terms of noise, bias stability, scale range and bandwidth,” Robert said. “Several design and technology improvements are right now under investigation.”

Manufactured on CEA-Leti's silicon pilot line, these gyroscopes can be co-integrated with high-performance 3-axis accelerometer and barometric-pressure sensors. Because it is compatible with most MEMS foundry processes, this technology can reach markets within two years.

CEA-Leti's and Politecnico di Milano's gyroscope technology is protected by more than five patents and CEA-Leti's M&NEMS platform by more than 25. The R&D team is continuing to work towards better performance, integration and cost.

ULVAC Expands Process Capability
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
Park Systems Combines AFM With White Light Interferometry
NTU Singapore Launches Quantum Science And Engineering Centre
ALD Is Taking Off In More-than-Moore Applications
Edwards Launches New Cryopump
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
CEA-Leti Unveils Navigation-Grade Gyroscopes
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
The All-round Smart Proximity Sensor Chip
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
BASF And Entegris Sign Agreement On Sale
ClassOne Appoints Industry Veteran Ken Gibbons
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
YES Partners With Osiris For Edge Film Removal Technology
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
Mycronic Receives Order For An SLX Mask Writer
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event