+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
Vendor View

Are you facing decisions and challenges with interconnects, pattern transfer, 3D scaling and atomic scale processing and integration?


Integrated materials solutions could be the answer.

Merck KGaA, Darmstadt, Germany released a video explaining its unique integrated materials solutions that speed innovation for novel architectures and product development.

In a world where hundreds of layers of materials are needed to build chips for applications such as AI, 5G, quantum and neuromorphic computing, extended reality (VR/AR), and more, materials innovation has become complex but essential and enabling.

Merck KGaA has deep materials expertise, and proven products and processes for every step of the manufacturing process. The company co optimizes individual process steps and accelerates development of advanced technology nodes and solve specific challenges.

  • Merck KGaA’s unique capability to bring together multiple materials and solutions across multiple semiconductor businesses to transition technology ideas to high volume manufacturing
  • The benefits of co-optimizing processes
  • An example of how the company addresses the process integration challenges associated with increased memory density for 3D NAND

For more information and to start innovating, visit bit.ly/SemiIntegratedMaterials.

Phlux Technology Secures £4m in Seed Funding
Start-ups: build up your ecosystem
Trends in the semiconductor industry
Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects
Advantest Introduces New inteXcell Series
Sony Semiconductor Israel Redefines IoT Connectivity Platform
Sensor Sales Stay Strong Due to Big ASP Rise
Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
Lam Research Acquires SEMSYSCO to Advance Chip Packaging
Infineon planning a major investment in a new factory in Dresden
Particle Measuring Systems introduces 10 nm aerosol particle counter
EBARA presents DYNOX Gas Abatement System
TSMC Launches OIP 3DFabric Alliance
DuPont reshapes IC materials manufacturing for post-COVID success
Evolving subfab vacuum challenges demand collaborative solutions
Next-gen low-k films can address present, future fabrication challenges
Critical Manufacturing redefines semiconductor MES for greater agility, success
Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Cutting FOPLP pattern distortion
EV Group advances leadership in optical lithography
ASM joins semiconductor climate consortium
KLA Launches New Double-Sided Direct Imaging Platform
Micron ships advanced DRAM technology with 1β node
Nor-Cal will do business as Pfeiffer Vacuum
ClassOne Equipment Releases Major New Lot of Used Semiconductor Tools for Resale
Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
Amkor to support European semiconductor ecosystem
Nanometre components require sub-nanometre precision
ALD TechDay for More-than-Moore devices
Cadence Expands Collaboration with Samsung Foundry
Semiconductor Manufacturing Analytics Maturity: Common Barriers and Methods to Advance
Lam Research Pledges $10 Million to FIRST Global

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: