Loading...
News Article

eBook explores automotive design

News

Mouser Electronics has published a new eBook in collaboration with Qorvo, highlighting the technology innovations reshaping automotive design.

In 'In The Future of Automotive;, subject matter experts from Qorvo and Mouser offer rich, practical analyses of technologies including vehicle-to-everything (V2X) architectures, ultra-wideband (UWB) communications, and on-board chargers (OBC) for electric vehicles.

The automotive industry is currently experiencing a broad range of technological innovations. As automotive manufacturers invest in electric vehicle design, the way in which we power our vehicles is changing. At the same time, new technologies and components are enabling the design of the connected vehicle. These advanced automobiles contain more safety features than their predecessors, while also supporting a variety of new entertainment and information possibilities for those traveling as passengers. The Future of Automotive, the new eBook from Mouser and Qorvo, offers a detailed collection of articles exploring the products and solutions underpinning these innovations.

The eBook highlights product information for six specific Qorvo solutions, connecting automotive designers to the components that will enable the next generation of automobile designs. The QPF1002Q Automotive Front End Module is optimised for cellular V2X systems, supporting real-time monitoring through low-latency direct transmission in the 5.9 GHz Intelligent Transportation System (ITS) band. Qorvo’s QPF1003Q Wi-Fi® Front End Module is designed for multi-standard systems, supporting Wi-Fi infotainment in connected vehicles.

The eBook also features information on the QPQ2200Q 5855-5925 MHz RF BAW Filter. The QPQ2200Q filter enables the coexistence of Wi-Fi and LTE signals with a connected vehicle’s C-V2X/DSRC signals, supporting the array of simultaneous functions required for a next-generation automotive experience.

Xenics Expands Its Advanced Imaging Portfolio
IDTechEx looks at sustainable helium use
Compact industrial 3kW programmable power supplies
PCIM Expo 2025 even bigger to meet growing demand for power electronics
Xiphera develops quantum-resilient hardware security solutions for space
Advantest to showcase IC test solutions at SEMICON India
ASMPT and TATA Electronics Private Limited form strategic partnership
Singapore and India sign MOU on semiconductor ecosystem partnership
The Netherlands expands export control measure for advanced semiconductor manufacturing equipment
Tech industry veteran Anders Storm named CEO of Dirac Research
Testing time in Taiwan
Electro Rent unveils large facility in Mechelen, Belgium
AEM expands system level test on AMPS Platform
Absolics turns to Solace
ACM Research receives orders for wafer-level packaging tools
En route towards the first German quantum computer
Element Six wins U.S. Department of Defense UWBGS program
ACM Research expands Fan-Out Panel-Level Packaging portfolio
Electroninks launches Copper MOD Ink
Advanced thermal control techniques to improve wafer manufacturing yield
Advances in active alignment engines for efficient photonics device test and assembly
Automation in semiconductor test processes: a key factor in modern production
ATE testing challenges of heterogeneous silicon chips with advanced packaging
Urgent orders boost wafer foundry utilisation in Q2
High performance inspection solutions at SMTAI 2024
Imec at the 50th IEEE European Solid-State Electronics Research Conference
Keysight unveils Wire Bond Inspection solution
Biden-Harris Administration reveals preliminary terms with HP
STMicroelectronics joins Quintauris as sixth shareholder
IDTechEx explores advanced semiconductor packaging
RPI and Hokkaido University sign Letter of Intent for semiconductor collaboration
KoMiCo to establish Mesa cleaning and coating facility
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: