+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

EUV Tech raises Series A funding

News

Capital to accelerate EUV Tech product roadmap in support of leading-edge semiconductor lithography.

EUV Tech has secured Series A funding led by Intel Capital. EUV Tech will use the capital to support its worldwide installed base of equipment, enhance its existing product line and deliver several new innovative products already under development. In conjunction with the financing, Sean Doyle, Intel Capital Managing Director, will join the board of directors to support the company’s growth.

EUV Tech fuels the semiconductor manufacturing industry with metrology solutions using extreme ultraviolet (EUV) and soft x-ray techniques. The company develops and manufactures mask metrology equipment to enable high-volume manufacturing of advanced semiconductors using EUV lithography. Its broad range of equipment includes EUV reflectometers, EUV pellicle tools, EUV phase metrology tools, and EUV mask imaging tools. Manufacturers use EUV Tech tools to manufacture the latest generation of semiconductor chips enabling higher computing power, decreased power consumption, and size optimization in chips and consumer devices.

EUV Tech tools are found on the production lines at major semiconductor manufacturers worldwide. The company has held long-term partnerships with many semiconductor manufacturers, consortiums, research centers and suppliers.

“It is an exciting time for the semiconductor manufacturing industry, and EUV Tech is primed and stands at the forefront of this next era in semiconductor manufacturing,” said Dr. Patrick Naulleau, CEO of EUV Tech. “We are thankful for and committed to our business partners and customers for their trust and support.”

“As high volume manufacturing utilizing EUV lithography grows, demand for mask technologies grows as well,” said Sean Doyle, Managing Director at Intel Capital. “EUV Tech plays an important role in supporting the EUVL ecosystem with a long history of manufacturing leading-edge tools for its worldwide customer base.”

This financing round comes on the heels of a year of major accomplishments including, appointing Dr. Patrick Naulleau, Ph.D., as the new CEO, rapid growth in the way of personnel, new product offerings, and an increase in industry-leading research and development (R&D) initiatives. EUV Tech’s latest product, the EUV N&K and Phase Measurement tool, was delivered to customers in the second half of 2022, and EUV Tech is set to further expand its product portfolio in 2023 and 2024.

The Series A funding will allow EUV Tech to improve and expand current product offerings, increase R&D resources and facilities, and support its global customer base.

Laser focus on Glasgow
Kaman Measuring introduces ThreadChecker
SandBox Semiconductor adds hybrid metrology capabilities
Intel empowers developers to 'Bring AI Everywhere'
Fab renovation: A blue CHIPS investment
Aqua Membranes collaborates with Micron Technology
Brewer Science releases Impact Report 2023
UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: