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News Article

Door to new wedge-wedge bond applications

Thursday 16th October 2003

WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815

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WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815

To Read More Click Here

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