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Door To New Wedge-wedge Bond Applications

WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815

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WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED
IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC
WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL
COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815


To Read More Click Here

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