News Article
Door to new wedge-wedge bond applications
WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED
IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC
WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL
COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815
To Read More Click Here
WHILE BALL BONDING IS THE MOST ECONOMICAL METHOD OF WIRING CHIPS TO PACKAGES IT IS LIMITED
IN APPLICATION TO AREAS WHERE HIGH TEMPERATURES ARE NOT A PROBLEM. THE COOLER ULTRASONIC
WEDGE-WEDGE WELDING TECHNIQUE HAS TO NOW SUFFERED FROM LOWER THROUGHPUTS. BOND TOOL
COMPANY HESSE & KNIPPS HOPES TO CHANGE THIS WITH ITS NEW BONDJET 815
To Read More Click Here
