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Tuesday 1st December 2009

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Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology

Global semiconductor equipment billings reached $135 billion in 2025

Everspin Technologies expands on-shore MRAM manufacturing capacity

New ZEISS Crossbeam 750 FIB-SEM designed for high-accuracy sample preparation workflows

SambaNova and Intel announce blueprint for heterogeneous inference

CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials

Reshore semiconductor manufacturing to UK and US to meet sustainability goals

Innatera launches Synfire

AI compute boom propels Foundry 2.0 market to $360 billion

Gartner forecasts worldwide semiconductor revenue to exceed $1.3 trillion in 2026

Q.ANT appoints Michael Krueger as Vice President Commercials

CEA-Leti, CEA-List and PSMC collaborate

OMRON appoints Virendra Shelar as President and CEO of its Industrial Automation Business in EMEA

UK Semiconductor Centre appoints two new Directors to its leadership team

NVIDIA AI Ecosystem expands

Hamamatsu Photonics and RIKEN sign framework agreement on collaboration

Plansee Group increases stake in Molymet

Quantum Diamonds expands to Asia

SmartRay sensor unites ECCO X innovations with high-precision glass inspection capabilities

Digital Twin Semiconductor Supply Chain market to reach $7.9 billion by 2033

Metallic Oxide Semiconductor Field Effect Transistor market to surpass $15.5 billion by 2033

Imec names NVIDIA’s Jensen Huang as recipient of the 2026 imec Lifetime of Innovation Award

Keysight introduces hands-on semiconductor teaching labs for universities

CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials

Nordson Electronics Solutions to demonstrate automated fluid dispensing and plasma treatment systems

Cosmic is born

Advantest to showcase latest test solutions at SEMICON China 2026 in Shanghai

OMRON introduces Detection Module for clean suit environments

Microelectronics US 2026 showcases practical solutions

Imec receives 'the world’s most advanced' High NA EUV system

Samsung and AMD expand strategic collaboration

Nordson Electronics Solutions expands distributor partnership with Assembly Products