ULVAC Plasma Ashing Systems – High-Performance Solutions for Demanding Applications

With over 40 years of experience in plasma ashing, ULVAC offers the ENVIRO series for R&D, pilot lines, and high-volume manufacturing. These systems enable efficient photoresist removal with high flexibility and process versatility.

System Variants
• ENVIRO-1Xa: Single chamber
• ENVIRO-1Xa 2C: Dual chamber
• ENVIRO-Optima: Triple chamber

Plasma Source Overview
• ICP (Inductively Coupled Plasma): High-rate removal, reliable, ideal for MEMS and HDIS
• MW (Microwave): Low-temperature polymer removal, ~50% less plasma-induced damage
• RF Bias: Complements ICP or MW, enables chemical + physical ashing/etching for advanced processes like anisotropic descum or carbonized layer removal

ULVAC Europe - Technology Expertise from Munich
Established in 1987, ULVAC GmbH in Munich serves the EMEA region. The portfolio includes vacuum and thin film equipment, analytical tools, and vacuum components such as pumps and leak detectors.

ULVAC provides solutions for semiconductors, MEMS, and displays—covering sputtering, etching, ion implantation, ashing, and thermal processes—tailored for R&D, pilot lines, and mass production.

Driving Innovation Through Vacuum Technology
With cutting-edge tools and deep process knowledge, ULVAC enables advanced manufacturing innovation. Learn more at www.ulvac.eu or email us at: ulvac@ulvac.de

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