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DIsco Announces New Dicing Saws

Semi-automatic saws offer small footprint and fast processing for 6 inch wafers

Japanese semiconductor equipment maker Disco Corporation has developed two new semi-automatic dicing saws, the DAD3221 and DAD3231, for 6 inch wafers.

The DAD3221 is said to have the world's smallest footprint (W490 x D870 mm) for this kind of equipment. The DAD3231 is designed for expandability and can accept wafers up to a maximum size of 8 inch (optional specification) and a die size of 210 x 210 mm (user-specified specification) by creating extra space in the equipment layout.

Features shared by both saws include: improved axis speed and internal communication speed; 5 percent shorter processing time compared to existing equipment; image recognition functions such as auto alignment, auto focus, and auto kerf check; and stable dicing for difficult-to-cut materials and thick wafers, including glass or ceramics.

Both models will be exhibited for the first time at SEMICON Japan 2016 (December 14 - 16 at Tokyo Big Sight).


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