+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Bosch commits €1bn investment to new fab to support IoT strategy

News

Bosch has announced it will be building a new wafer fab in Dresden, Germany, as part of its commitment to investing in internet of things (IoT) technology.

The new location will manufacture the 12-inch wafer chips used in a growing number of IoT and mobility applications. Construction of the high-tech plant is expected to complete by the end of 2019, with manufacturing operations starting towards the end of 2021. Total investment will come to around €1bn, with as many as 700 new jobs created.

Dr. Volkmar Denner, Chairman of the Robert Bosch GmbH Board of Management said: "The new wafer fab is the biggest single investment in Bosch's more than 130-year history. "Semiconductors are the core components of all electronic systems. With connectivity and automation growing, they are being used in more and more areas of application. By extending our semiconductor manufacturing capacity, we are giving ourselves a sound basis for the future and strengthening our competitiveness."

The investment in the new fab marks a key milestone in Bosch's IoT growth strategy. According to a study by PwC, the global semiconductor market is set to grow by more than 5 percent annually up to 2019, with the mobility and IoT market segments growing especially strongly.

12-inch technology as the basis for economies of scale

Semiconductors are an essential technology for the modern age, as they enable manufacturing, mobility and homes to become increasingly connected, electrified, and automated.

Bosch's move into 12-inch wafer technology means it can offer the economies of scale necessary to meet the rising demand for semiconductors triggered by the growth in smart homes and cities.

Leading semiconductor manufacturer and pioneer of MEMS fabrication

With a rich heritage in the manufacture of semiconductors, Bosch has been making several varieties, particularly focussed on application-specific integrated circuits (ASICs), power semiconductors and micro-electro-mechanical systems (MEMS) for more than 45 years.

Bosch is a pioneer and the world's leading manufacturer of MEMS sensors. Over 20 years the company developed the microfabrication technique, known worldwide as the "Bosch process" which is also used to make semiconductors and Bosch ASICs have been used in vehicles since 1970. They are customised to individual applications, and essential for functions such as airbag deployment. In 2016, every car rolling off the production lines worldwide had on average more than nine Bosch chips on board.

At its wafer fab in Reutlingen, Germany, Bosch currently manufactures around 1.5 million ASICs and 4 million MEMS sensors a day. Today, 75 percent of Bosch MEMS sensors are used in consumer and communications electronics applications and can be found in three out of four smartphones. Bosch's current semiconductor portfolio includes acceleration, yaw, mass-flow, pressure, and environmental sensors, as well as microphones, power semiconductors, and ASICs for vehicle ECUs.

Photonis announces agreement to acquire Xenics, a leader in Infra-Red imaging solutions
Phlux Technology Secures £4m in Seed Funding
Start-ups: build up your ecosystem
Trends in the semiconductor industry
Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects
Xenics introduces Wildcat+ 640
Advantest Introduces New inteXcell Series
Sony Semiconductor Israel Redefines IoT Connectivity Platform
Sensor Sales Stay Strong Due to Big ASP Rise
Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
Lam Research Acquires SEMSYSCO to Advance Chip Packaging
Infineon planning a major investment in a new factory in Dresden
Particle Measuring Systems introduces 10 nm aerosol particle counter
EBARA presents DYNOX Gas Abatement System
TSMC Launches OIP 3DFabric Alliance
DuPont reshapes IC materials manufacturing for post-COVID success
Evolving subfab vacuum challenges demand collaborative solutions
Next-gen low-k films can address present, future fabrication challenges
Critical Manufacturing redefines semiconductor MES for greater agility, success
Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Cutting FOPLP pattern distortion
EV Group advances leadership in optical lithography
ASM joins semiconductor climate consortium
KLA Launches New Double-Sided Direct Imaging Platform
Micron ships advanced DRAM technology with 1β node
Nor-Cal will do business as Pfeiffer Vacuum
ClassOne Equipment Releases Major New Lot of Used Semiconductor Tools for Resale
Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
Amkor to support European semiconductor ecosystem
Nanometre components require sub-nanometre precision
ALD TechDay for More-than-Moore devices
Cadence Expands Collaboration with Samsung Foundry

{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: