Orbotech's SPTS Technology Chosen By Chipmore
SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has announced that it has been selected by Chipmore Technology Corporation Limited, an LCD driver integrated chip (IC) packaging specialist, to supply physical vapor deposition (PVD) solutions for the under bump metallization (UBM) and redistribution layers (RDL) for their flip-chip packaging line.Chipmore chose the Sigma fxP PVD solution for their new copper (Cu) bumping line, as it provides superior results and lowest cost of ownership over competitor systems.
"Consumer demand for high-end smartphones and other mobile devices with higher resolution screens are driving the rapid growth of advanced display driver IC's," stated Mr. Kevin Crofton, Corporate Vice President at Orbotech and President of SPTS Technologies. "Our Sigma fxP PVD system provides Chipmore with the most cost effective means to expand their bumping capacity to meet the demand from display-driver IC manufacturers."
Mr. Sampus Yang, Vice President at Chipmore stated: "Chipmore offers a range of bumping solutions for our global customers, ranging from high-end gold bumping to cost-effective copper bumping for flip chip packaging. SPTS's Sigma fxP PVD system produces high quality copper pillars with excellent throughput and low cost of ownership, which allows us to remain competitive in a highly cost-sensitive market. The additional bumping capability will allow us to capitalize on consumers' growing appetite for higher resolution LCD displays and strengthen our reputation as a top packaging services company."
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
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