INTEL custom foundry certifies ANSYS tools for 22 nm FinFET technology
Intel Custom Foundry customers are delivering powerful, innovative products thanks to the certification of ANSYS solutions for electromigration, power and electrostatic discharge reference flows for Intel 22nm FinFET low-power (22FFL) process technology. The supported tools from ANSYS and Intel Custom Foundry's collaboration enable mutual customers to minimize design costs and risks while quickly bringing cutting-edge and reliable products to market. IoT and entry mobile products demand higher performance with less power consumption and excellent reliability. To achieve this today, multiple subsystems of an electronic product are combined into one or more integrated circuits known as a system on a chip (SoC).
ANSYS simulation tools deliver needed accuracy while reducing turnaround time to meet the increased computational requirements caused by the growing design complexity of modern products. Advanced technology support in ANSYS RedHawk, ANSYS Totem and ANSYS PathFinder, including electromigration rule compliance, deliver greater reliability and manufacturability, as well as minimize risk and lower cost. Intel's new 22FFL process technology offers a unique blend of high-performance and ultralow-power transistors combined with simplified interconnects and simpler design rules to deliver a versatile FinFET design platform for low-power and mobile products. It offers up to 100x lower leakage compared with the previous Intel 22GP (general purpose) technology.
The Intel 22FFL also delivers drive currents on par with Intel's 14 nm transistors while delivering true 22nm class scaling at 17.8 MTr/mm2, enabling better performance and power than any industry planar technology can achieve. The certification from Intel Custom Foundry for its advanced 22FFL process technology validates the capability to simulate designs while maintaining sign-off accuracy. It enables designers to meet demanding power and reliability requirements for their intellectual properties, analog and custom integrated circuit designs. Mutual customers of Intel Custom Foundry and ANSYS can design cutting-edge applications such as mobile and low power IoT products based on this 22FFL certification.
"22FFL is a unique new technology that provides a compelling combination of performance, power, density and ease of design for low-power IoT and mobile products," said Venkat Immaneni, senior director, Foundry Design Kit Enablement for Intel Custom Foundry.
"The certification of ANSYS tools combined with the comprehensive Intel Custom Foundry 22FFL platform gives our mutual customers a competitive advantage when implementing robust, high-performance intellectual properties and SoCs on our new 22FFL offerings."
"Power, electromigration and electrostatic discharge reference flows are absolute requirements to create smart, robust IoT and entry mobile products. Our collaboration with Intel Custom Foundry on the 22FFL design platform and its certification of ANSYS solutions emphasize the high-quality results and benefits of ANSYS simulation tools," said John Lee, general manager at ANSYS. "This collaborative effort further empowers Intel Custom Foundry customers to confidently build the next-generation of robust and reliable computing products for low-power IoT and mobile products."
