Gore Launches Compact Cable Protection Systems For Packaging Interconnects
W. L. Gore & Associates (Gore) introduces its new GORE Cable Protection Systems for packaging copper and fiber interconnects in civil aircraft applications. This extremely durable system meets the needs of aircraft OEMs and systems suppliers requiring more protection in compact systems for interconnects installed in high-density data transmission and in-flight entertainment (IFE) backbones. GORE™ Cable Protection Systems are engineered with crush- and abrasion-resistant materials that provide the highest level of durability and protection available on the market today. Copper wire and fiber optic cables (round and flat) can float freely within these cable systems without getting damaged during complex routing in cable runs and sharp edges in an airframe.
Gore's specialized design also allows installers to bend copper and fiber within the specification limit, generally without exceeding the minimum bend radius "” eliminating over bending, breakage and failure. In addition, these new cable protection systems are considerably smaller and lighter weight with greater flexibility and a tighter bend radius for easy and rapid installation, ultimately reducing overall costs. "Our cable protection systems provide a great lightweight solution to protect high-performance interconnects required to enable today's high-speed architecture and future designs," said Jeremy Moore, Application Engineer for Gore's Civil Aerospace Team. GORE Cable Protection Systems complement Gore's wide variety of aerospace solutions, including high-speed data cables, high-frequency microwave/RF cable assemblies, aircraft sealants, and more.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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