Intevac To Present Fan-Out Packaging At SEMICON Korea
Intevac, a supplier of thin-film processing systems, has announced its participation in the SEMICON Korea 2018 Electropackage System and Interconnect Product Technical Symposium. The company will present a technical paper on its "Ion Beam Source for RDL Pre-Clean in Fan-Out Wafer and Fan-Out Panel Level Packaging" at the COEX exhibition center.
Semiconductor device packaging technology in general, and fan-out wafer-level packaging (FOWLP) / fan-out panel-level packaging (FOPLP) technology in particular, is being driven by the strong cost advantages these advanced packaging technologies offer over the expense of implementing continued Moore's Law progress for sub-10nm semiconductor IC process nodes. Fan-out packaging provides for increased I/O (Input/Output) density for a given semiconductor device while simultaneously supporting smaller die sizes, thereby reducing the amount of space integrated circuit content occupies in handheld consumer electronic products, such as smartphones, wearables, and Internet of Things (IoT) devices.
The INTEVAC MATRIX is a high-productivity, substrate-independent thin-film processing platform that is well-positioned for multiple fan-out packaging applications. The MATRIX Physical Vapor Deposition (PVD) system offers a much-reduced cost of ownership (COO) over the current PVD process tools being used for Redistribution Layer (RDL) barrier/seed layer applications, and also offers the flexibility to run multiple substrates on the same system, from wafer-level (round) substrates to panel-level (square or rectangular) substrates, which today are up to 600mm in diameter.
In addition to the SEMICON Korea 2018 presentation, Intevac's other recent technical papers on advanced packaging processes developed on the MATRIX were featured at IWLPC 2017 in San Jose, CA; EPTC 2017 in Singapore; and at SEMICON Japan 2017 in Tokyo. Copies of these papers are available upon request.