Info
Info

ASE Breaks Ground On K25 Factory Building In Kaohsiung

 


The ASE Group broke ground on its latest factory
building – K25, located in the Nantze Export Processing Zone 2 in Kaohsiung,
Taiwan. The building is scheduled to be completed in the year 2020 and is
expected to create more than 1800 job opportunities.

The K25 building will be ASE’s state of the art facility
with a high degree of automation, intelligent manufacturing processes and smart
logistics. K25 will have a total of 355,800 square feet of floor space that
will be used to research, develop and manufacture advanced semiconductor chips
in applications for IoT, robotics, data science, artificial intelligence, self
driving vehicles, high end graphics and more. The design and layout of building
K25 has been carefully planned using local and global green standards,
fulfilling the company’s commitment to corporate sustainability.

The ground breaking ceremony today was officiated by Chen
Chu, Mayor of Kaohsiung and Jason Chang, Chairman and CEO of ASE.



Helium Leak Detector Solutions
Brewer Science Announces RDL-first Fan-out Packaging Material
Murata Invests In MEMS Sensor Manufacturing
Teledyne E2v’s Emerald 12M And 16M Image Sensors Enter Mass Production
Thermco Systems Expands Global Operations With Acquisition Of CSD Epitaxy
Nova's Materials Metrology Solution Selected For 5nm Technology Node
Healthcare Transformation: A Business Opportunity For BioMEMS
NXP Acquires OmniPHY To Accelerate Autonomous Driving And Vehicle Networks
Palomar Technologies Awarded ISO 9001:2015 Certificate
New Material Could Improve Efficiency Of Computer Processing And Memory
Sensirion Announce Strong Revenue Growth In First Half-year 2018
Chroma Offers Semiconductor Test Solutions
China’s Semiconductor Fab Capacity To Reach 20 Percent Worldwide Share In 2020
UGent And Imec Launch Fiber Optic Sensing Spin-off Sentea
VTT Is Ranked Fourth In The World's Largest Research Funding Programme
SiTime And Bosch Accelerate Innovation In MEMS Timing For 5G And IoT
Infineon Adds 200 V Half-bridge Gate Driver IC For Reliable Start-up Operation
NanoScientific Symposium On Scanning Probe Microscopy (SPM)
Rudolph Technologies Launches Second-gen Inspection And Metrology System
GLOBALFOUNDRIES Reshapes Technology Portfolio To Focus On Differentiated Offerings
KLA-Tencor Expands IC Packaging Portfolio
Himax Technologies Rebukes Motley Fool Article
Infineon Expands U.S.-based IoT Security Research And Development Programs
Imec.xpand Raises EUR 117 Million To Invest In Innovative, Early-stage Ideas

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info