Info
Info

Advantest To Exhibit Advanced Nanotechnology Tools At EMLC

 

Semiconductor test equipment supplier Advantest will feature its E3640 Multi Vision Metrology Scanning Electron Microscope (MVM-SEM) at the upcoming European Mask and Lithography Conference in Grenoble, France on June 18-20 in Stand #1. This advanced tool supports pattern measurement for photomasks and other patterned media at dimensions as small as 1Xnm. The annual EMLC conference brings together scientists, researchers, engineers, and technologists from research institutes and companies from around the world to present innovations at the forefront of mask lithography and mask technology.

Also highlighted at the booth will be Advantest’s F7000 EB (electron beam) lithography system, which delivers high throughput and highly-accurate and smooth nano-patterns on wafers and masks from 1X-nm resolution. Its direct-write technology makes it well suited as a design tool for research and development as well as a solution for LSI production lines, where small-lot-multiple-type devices are produced. Using character projection technology, the system offers high throughput for both prototyping and production.

Advantest’s portfolio of nanotechnology solutions also includes several other products. Among them are the E3310 and E3640 Mask MVM-SEM systems which enable real-time, 3D measuring and imaging of wafers and masks. For tri-gate processes, the E3310 Wafer MVM-SEM offers high efficiency for volume production. The E3640 Mask MVM-SEM system delivers the industry’s best pattern-measurement capability and high throughput for applications including standard photomasks, EUV photomasks and NIL templates. While the E5610 Mask DR-SEM is designed for reviewing and classifying ultra-small defects in next-generation photomasks and blanks. The system offers highly stable, fully automatic image capturing with the long-term operational stability and reliability essential for manufacturing analyses of critical masks.

Palomar Technologies Awarded ISO 9001:2015 Certificate
Teledyne E2v’s Emerald 12M And 16M Image Sensors Enter Mass Production
Brewer Science Announces RDL-first Fan-out Packaging Material
Sensirion Announce Strong Revenue Growth In First Half-year 2018
VTT Is Ranked Fourth In The World's Largest Research Funding Programme
UGent And Imec Launch Fiber Optic Sensing Spin-off Sentea
Chroma Offers Semiconductor Test Solutions
KLA-Tencor Expands IC Packaging Portfolio
China’s Semiconductor Fab Capacity To Reach 20 Percent Worldwide Share In 2020
Infineon Adds 200 V Half-bridge Gate Driver IC For Reliable Start-up Operation
NanoScientific Symposium On Scanning Probe Microscopy (SPM)
Himax Technologies Rebukes Motley Fool Article
Helium Leak Detector Solutions
Healthcare Transformation: A Business Opportunity For BioMEMS
NXP Acquires OmniPHY To Accelerate Autonomous Driving And Vehicle Networks
Imec.xpand Raises EUR 117 Million To Invest In Innovative, Early-stage Ideas
Murata Invests In MEMS Sensor Manufacturing
Infineon Expands U.S.-based IoT Security Research And Development Programs
SiTime And Bosch Accelerate Innovation In MEMS Timing For 5G And IoT
Thermco Systems Expands Global Operations With Acquisition Of CSD Epitaxy
Nova's Materials Metrology Solution Selected For 5nm Technology Node
GLOBALFOUNDRIES Reshapes Technology Portfolio To Focus On Differentiated Offerings
Rudolph Technologies Launches Second-gen Inspection And Metrology System
New Material Could Improve Efficiency Of Computer Processing And Memory

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info