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3D-Micromac Introduces Selective Laser Annealing System

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3D-Micromac supplier of laser micromachining and
roll-to-roll laser systems for the semiconductor, photovoltaic, medical device
and electronics markets, has the microPRO RTP—its new laser annealing system
designed to enable several key process steps in semiconductor, power device and
MEMS manufacturing. Combining a state-of-the-art laser optic module with
3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP
provides selective annealing with high repeatability and throughput in a
versatile system.

The microPRO RTP features a line scan option for vertical
selective annealing and a step-and-repeat spot option for horizontal selective
annealing, as well as three optional laser wavelengths (near infrared, green
and ultraviolet). The microPRO RTP addresses a variety of applications,
including:

Dopant activation for insulated gate bipolar transistors
(IGBTs), as well as activation of backside illuminated (BSI) CMOS image sensors
and amorphous silicon (a-Si) – the microPRO RTP uses a high-speed line scan
with excellent energy homogeneity and repeatability to provide precise
localization of the field stop layer, which minimizes heat transference to the
front-side of the wafer

Ohmic contact formation in silicon carbide (SiC) power
devices to improve resistance – using spot scanning with short laser pulses,
microPRO RTP can process the entire metalized backside of SiC wafers, forming
ohmic interfaces and curing grinding defects, while preventing the generation
of large carbon clusters and heat-related damage to the front-side of the wafer

Giant magneto resistive (GMR) and tunneling magneto
resistive (TMR) sensor manufacturing – using a selective step-and-repeat spot
and variable laser energy, microPRO RTP can selectively heat functional areas
on the sensor to form and orient the magnetic fields for these MEMS sensor
types

“As microelectronics adopt 3D/stacked architectures to
achieve more functionality, manufacturers need annealing solutions that can
process the surface layers of their devices without affecting buried structures
underneath. The migration to new materials and heterogeneous integration adds
even more complexity to the annealing process, driving the need for selective
exposure of functional areas, which only selective laser annealing can provide.
Leveraging our years of experience in providing laser solutions to the
semiconductor and microelectronics market, 3D-Micromac is pleased to offer our
new microPRO RTP laser annealing solution, which provides the selectivity,
flexibility and throughput our customers need to meet their unique annealing
requirements," stated Hans-Ulrich Zühlke, product manager at 3D-Micromac.

The microPRO RTP provides numerous advantages compared to
existing annealing methods, including:

High precision and repeatability in both X and Y directions

High selectivity to different substrates and films, with
multiple options for laser pulse length, energy and overlap to ensure no damage
to the area surrounding the target site

Very high energy homogeneity

Precise process monitoring

Flexibility to handle substrate diameters ranging from 50mm
up to 300mm


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