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Brewer Science Announces RDL-first Fan-out Packaging Material

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Brewer Science has announced from SEMICON Taiwan the latest additions to its industry-leading BrewerBOND family of temporary bonding materials, as well as the first product in its new BrewerBUILD line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers' evolving wafer-level packaging challenges.

The BrewerBOND T1100 and BrewerBOND C1300 series combine to create Brewer Science's first complete, dual-layer system for temporary bonding and debonding of product wafers. The new system was developed for power, memory and chip-first fan-out devices - all of which have stringent requirements with respect to temperature, power and performance. The system can be used with either mechanical or laser debonding methods.

The BrewerBUILD material was specifically created for redistribution-layer (RDL)-first fan-out wafer-level packaging (FOWLP). Developed to meet the needs of chipmakers looking to transition from chip-first FOWLP but not yet ready to tackle 2.5D/3D packaging, the single-layer material is compatible with both wafer- and panel-level temporary bonding/debonding processes.

"As industry requirements advance, Brewer Science continues to push forward the state of the art in our materials offerings," said Kim Arnold, executive director, Advanced Packaging Business Unit, Brewer Science Inc. "Through close collaboration with our customers, we are driving the technology forward, leveraging our R&D braintrust to create unique solutions like these that are designed to meet customers' needs - current and future."


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