Info
Info

KLA-Tencor Expands IC Packaging Portfolio

 
KLA-Tencor’s new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.

KLA-Tencor has announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges. The Kronos 1080 system offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition. The ICOS F160 system examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types—including sidewall cracks, a new defect type affecting the yield of high-end packages. The two new inspection systems join KLA-Tencor's portfolio of defect inspection, metrology and data analysis systems that help accelerate packaging yield and increase die sort accuracy.

KLA-Tencor’s new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.

"As chip scaling has slowed, advances in chip packaging technology have become instrumental in driving device performance," said Oreste Donzella, Senior Vice President and Chief Marketing Officer at KLA-Tencor. "Packaged chips need to achieve simultaneous targets for device performance, power consumption, form factor and cost for a variety of device applications. As a result, packaging design has become more diverse and complex, featuring a range of 2D and 3D structures that are more densely packed and shrinking in size with every generation. At the same time, the value of the packaged chip has grown substantially, along with electronics manufacturers' expectations for quality and reliability. To meet these expectations, packaging manufacturers, whether in the back end of a chip manufacturing fab or in an outsourced assembly and test (OSAT) facility, have demanded more sensitive, cost-effective inspection, metrology and data analysis—and more accurate identification of bad parts. Our engineering teams have developed the new Kronos 1080 and ICOS F160 systems to serve the electronics industry's growing needs for production-worthy defect detection for a wide variety of packaging types."

The Kronos 1080 system is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control. Advanced packaging technology necessarily includes ever-smaller features, higher-density metal patterns, and multi-layer redistribution layers—all of which have increasing inspection requirements that demand innovative solutions. The Kronos system achieves its industry-leading performance through multi-mode optics and sensors and advanced defect detection algorithms. The Kronos system also introduces FlexPoint, an advanced technology derived from KLA-Tencor's leading inspection solutions for IC chip manufacturing. FlexPoint focuses the inspection system on key areas within the die where defects would have highest impact. Flexible wafer handling enables the inspection of high-warp wafers, frequently encountered in a package type called fan-out wafer-level packaging—an established type for mobile applications and an emerging technology for networking and high-performance computing.

After wafer-level packages are tested and diced, the ICOS F160 performs inspection and die sorting. Manufacturers of high-end packages, such as those used for mobile applications, will benefit from new capability to detect laser-groove, hairline and sidewall cracks. These cracks result from a change in the materials used to insulate the dense on-chip metal routing to facilitate increased speed and reduced power consumption. The new material is brittle, making it susceptible to cracks during wafer dicing. Sidewall cracks are notoriously difficult to detect, as they lie perpendicular to the top of the die and are not detectable using traditional visual inspection. Another major advantage of the ICOS F160 system, beneficial to many packaging types, is its flexibility: input and output modes can be wafer, tray or tape. The system is easily changed from one configuration to another. Its automatic calibrations and precision die pickup facilitate increased tool utilization in high volume manufacturing environments.

The Kronos 1080 and ICOS F160 systems are part of KLA-Tencor's portfolio of packaging solutions designed to address inspection, metrology, data analysis and die sorting needs for a variety of IC packaging types. This portfolio includes the CIRCL -AP all-surface wafer inspection system, Zeta-580/680 3D metrology system for wafers and panels, ICOS T890, T3 and T7 Series component inspection and metrology systems, and Klarity data analytics system. More information about the two new defect inspection systems and KLA-Tencor's full packaging solution portfolio can be found on the packaging portfolio web page.

Murata Invests In MEMS Sensor Manufacturing
Infineon Adds 200 V Half-bridge Gate Driver IC For Reliable Start-up Operation
NXP Acquires OmniPHY To Accelerate Autonomous Driving And Vehicle Networks
Brewer Science Announces RDL-first Fan-out Packaging Material
GLOBALFOUNDRIES Reshapes Technology Portfolio To Focus On Differentiated Offerings
Imec.xpand Raises EUR 117 Million To Invest In Innovative, Early-stage Ideas
Himax Technologies Rebukes Motley Fool Article
Chroma Offers Semiconductor Test Solutions
Teledyne E2v’s Emerald 12M And 16M Image Sensors Enter Mass Production
Infineon Expands U.S.-based IoT Security Research And Development Programs
Rudolph Technologies Launches Second-gen Inspection And Metrology System
Healthcare Transformation: A Business Opportunity For BioMEMS
China’s Semiconductor Fab Capacity To Reach 20 Percent Worldwide Share In 2020
NanoScientific Symposium On Scanning Probe Microscopy (SPM)
UGent And Imec Launch Fiber Optic Sensing Spin-off Sentea
SiTime And Bosch Accelerate Innovation In MEMS Timing For 5G And IoT
Sensirion Announce Strong Revenue Growth In First Half-year 2018
Palomar Technologies Awarded ISO 9001:2015 Certificate
VTT Is Ranked Fourth In The World's Largest Research Funding Programme
Nova's Materials Metrology Solution Selected For 5nm Technology Node
Thermco Systems Expands Global Operations With Acquisition Of CSD Epitaxy
KLA-Tencor Expands IC Packaging Portfolio
Helium Leak Detector Solutions
New Material Could Improve Efficiency Of Computer Processing And Memory

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info