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Rudolph Technologies Announce The Receipt Of Over $12 Million In New Orders

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Rudolph Technologies has announced the receipt of over $12 million
in new orders for its recently-released NovusEdge system for edge and backside
inspection on bare silicon wafers. The new orders are for capacity expansions
at our existing customers as well as orders from two additional large wafer
manufacturers based in Asia. These orders are in addition to the $3M previously
announced and will ship throughout calendar year 2019.

“With these orders Rudolph has expanded its customer base to
include the top wafer suppliers with over 75% of the bare wafer market share,”
said Mike Plisinski, Rudolph Technologies' CEO. “We believe the early
acceptance of these new systems is being driven by the accelerating demand for
high-quality bare silicon wafers for sub 20nm nodes. To meet that demand
customers require an inspection solution with increased sensitivity on the
wafer edge and backside. The Rudolph team worked closely with bare wafer manufacturers
in order to introduce a new product with compelling capabilities and value of
ownership. As the rate of die shrinks slows at the advanced nodes, more wafers
are required to make enough die to meet growing market demand, especially for
advanced memory and logic chips.”

Chips and micro-fractures at the edge readily propagate as
cracks into active areas of the wafer, especially when the wafer is thinned.
Backside contamination can distort the frontside of the wafer during
lithography, consuming focus budgets that are already thin and will become even
thinner with the adoption of EUV lithography.

Edge and backside inspection have requirements that are very
different from conventional frontside inspection. The NovusEdge EBI (Edge,
Backside Inspection) system's image-based approach provides full coverage of
near-edge, bevel and apex regions, both top and bottom. Compared to existing
technology, it is faster, more sensitive and better at classifying types of
defects, especially for the complex shapes and curvatures at the notch.
Backside inspection can use the same light scattering techniques used on the
frontside but requires special handling capabilities to avoid contacting or
contaminating the frontside. In all cases, sophisticated software provides analysis
and automatic defect classification.


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