Info
Info
News Article

A*STAR And Soitec Announce Joint Program

News

Partnership to develop new layer transfer process for advanced packaging

Singapore's Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics (IME) and Soitec (Euronext Paris), a semiconductor materials firm, have launched a joint program to develop and integrate a new layer transfer process within advanced wafer level multi-chip packaging techniques.

Based on the combination of IME's Fan-Out Wafer Level Packaging (FOWLP) and 2.5D Through Silicon Interposer (TSI) technologies with Soitec's Smart Cut technology, the new cost competitive process offers higher performance, energy efficiency and increased product yield.

The rising complexity of today's chips with growing numbers of smaller and smaller transistors and circuits requiring high I/O counts is driving collaborative innovation across the advanced packaging process community focused on identifying cost effective solutions for manufacturing, and increased data bandwidth to support hand-held, cloud and edge computing applications.

One of the standard processes in advanced packaging involves using a full silicon wafer for the layer transfer process, which can cost up to 3 cents/mm2. Soitec will partner with IME over the next three years to evaluate the use of its Smart Cut technology on IME's advanced packaging platforms FOWLP and 2.5D TSI, with the objective to integrate a new layer transfer process as a key step in future generations of packaging techniques. This new process targets improved performance, lower power consumption and reduced production costs by eliminating the need to consume a full silicon wafer. IME will also conduct tests to evaluate the reliability and robustness of the newly developed process, which will help Soitec to determine its long-term viability.

Smart Cut technology makes use of both implantation of light ions and wafer bonding to define and transfer ultra-thin single-crystal layers from one substrate to another. It works like an atomic scalpel and allows active layers to be managed independently from the supporting mechanical substrate. Key benefits include the creation of multiple thin nanometric scale layers of virtually defect-free silicon by using low temperature bond and split techniques. These layers are then placed on top of active transistor circuitry. The thickness of the transferred layer can be determined with a high degree of precision by adjusting the implantation energy and process engineering. Transistors can then be completed using etch and deposition processes. Moreover, the donor substrate can be reused many times as the surface of the silicon wafer is repolished after each layer transfer operation, and the substrate can be reused.

Through this collaboration with Soitec, IME will provide advanced packaging expertise in architecture definition, modelling, design, process-integration, reliability-assessment and failure analysis. IME will execute the advanced packaging development in its fully functional, state of the art 300mm wafer level packaging, 2.5D/3DIC pilot line. IME's end-to-end process capabilities and know-how in advanced FOWLP and 2.5D TSI will shorten development cycles and demonstrate cost-effective packaging solutions using Smart Cut technology. During the joint program, Soitec will contribute significant tool time, R&D personnel, and dedicated space in its clean room at its Pasir Ris fabrication facility in Singapore.

"Advanced packaging continues to be a bright spot in the high-value semiconductor market. We are excited to partner Soitec to develop packaging solutions that will contribute to the dynamic growth of this high-potential segment in Singapore and worldwide," said Dim-Lee Kwong, covering executive director, IME.

“Soitec and IME believe Smart Cut technology will deliver breakthrough results, revolutionising 2.5D/3D layer transfer process flow,” said Christophe Maleville, Soitec's chief technology officer. “This strategic collaboration will not only develop a new Smart Cut application serving new generations of advanced packaging, but also open a brand-new market for Soitec beyond traditional engineered substrate manufacturing.”

Infineon Withdraws Outlook For FY20
Dow Launches Fast Curing Silicone Adhesive
Ereztech Expands US Footprint, Opens R&D Lab
Oxford Instruments’ Plasma Technology And NanoScience Businesses Collaborate With The Consortium
Semiconductor Manufacturing: Achieving Water Authority Compliance
Particle Measuring Systems Releases 20 Nm Syringe Sampler
Imagination Technologies Commits To The UK As It Looks To Accelerate Growth In New Areas Of Technological Innovation
WEBINAR: Smart Manufacturing
Picosun Reinforces Local Operations During The COVID-19 Epidemic
Structural Defects In A TO-220
ACM Research Launches Stress-Free Polishing Tool For Advanced Packaging Applications; Delivers First Tool To Leading Chinese OSAT
Semiconductor Memory Adoption To Be Augmented By Penetration Of Smartphones Across The Globe
The AP&S Demo Center Will Help You. Request Your Wet Process Demonstration And Be Part Of It Live Via Video Chat.
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
Park Systems Announces $1 Million Dollar Nano Research Grant Fund
Intel Shines Amidst The Carnage Of The 2019 Semiconductor Market
DISCO Presented With The Supplier Continuous Quality Improvement (SCQI) Award By Intel Corporation
SUSS MicroTec Purchases The Inkjet Printer Division Of Meyer Burger B.V.
Infineon Technologies AG Completes Acquisition Of Cypress Semiconductor Corporation
Imec Builds World’s First Spiking Neural Network-Based Chip For Radar Signal Processing
Efinix’s Trion FPGA Silicon Platform Expands Into Europe
Park Systems Completes Equity Investment In Molecular Vista
High-end Inertial Sensors: At The Dawn Of A Mass-adoption?
Picosun And A*STAR’s IME To Create Novel, High Performance Memories

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}