News Article

Atomic-scale Memristive Devices: Small, Smart And Scalable


Atomic-scale electrochemical metallization cells enabled by the NanoFrazor were demonstrated by Bojun Cheng and his colleagues from Prof. Leuthold's group at ETH Zürich. Electrochemical metallization cells (EMC), or conductive bridging random access memory (CBRAM), usually consist of metal-insulator-metal layer stacks, where one metallic player plays a role of an active electrode, and the other - of the inert one. To switch between different states, the cell electrochemically grows or dissolves a tiny metal filament between the electrodes. EMCs reported in Communications Physics feature low switching voltage around 100 mV, operation speed in the nanosecond range, extinction resistance ratio as high as 6 × 105, reliable operations, and the possibility to achieve multi-level behavior.

Such impressive performance at the atomic scale is achieved due to the device geometry: one of the electrodes (Pt) is flat, whereas the other one (Ag) is essentially a 3D tip about 10 nm in radius, creating a highly confined electric field in a few nm-thick SiO2 switching matrix. The tip geometry was defined in the PPA resist using the NanoFrazor and then transferred into the SiO2 by reactive ion etching. During switching, a few-atoms long filament forms between the electrodes, acting as a conductive bridge. In such EMCs, filaments suffer little from Joule heating, as they operates near the ballistic limit and most of the power dissipation occurs in the metallic electrodes and not the filament itself.

Reliable performance together with nm-scale footprint make such EMCs very promising for non-volatile memory applications. With help of thermal scanning probe technology, fabrication of such devices can be significantly scaled up without compromising the dimensions of 3D tip.

Webinar: AC Power Control: Configurable /flexible /robust Hardware Based Controller Solutions
VentureLAB And Silicon Catalyst Partner To Expand Silicon Ecosystem
Picosun’s Success Brings Chairman Of The Board National Entrepreneur Award Of Finland 2020
EV GROUP Addresses Key Process Gap In Heterogeneous Integration
High Customer Satisfaction With Picosun’s New Service And Support Model
MagnaChip Completes Sale Of Foundry Services Group And Fab 4
SINGULUS Receives Order From Leading Semiconductor Foundry
ULVAC Techno Offers Equipment Support In Japan And East Asia
IGBT Modules Interrogated Acoustically
STMicroelectronics Launches Inclinometer With Machine-Learning Core
ACM Research Highlights WLP Processing Equipment For OSAT Customers
SUSS MicroTec And DELO Collaborate On Imprint Lithography
ClassOne’s Solstice LT Plating System Selected By Jenoptik
Mentor Helps SimpleMachines Speed Development Of First AI Processor
Detection Technology Launches X-Panel 1412
Deca Announces Chiplet Advanced Packaging Partnership With ADTEC
IMT Modernizes MEMS Foundry Services With Plasma Etch Solution
EV Group Brings Maskless Lithography To High Volume Manufacturing
Multibeam To Develop Full-Wafer, All-Maskless Patterning At 45 Nm
Panasonic Completes Transfer Of Semiconductor Business To Nuvoton
Dialog Semiconductor Licenses Its Non-Volatile Resistive RAM Technology To GLOBALFOUNDRIES
Global Semiconductor Sales Increase 4.9 Percent
Keep Calm And Carry On – Covid 19 And The Semiconductor Industry
Watlow Acquires CRC

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: