Info
Info

Western Digital And AMD Address Memory Scaling Demand For Fast-Growing In-Memory Computing Workloads



Western Digital announced the latest memory extension solution with AMD to meet the need of a
growing number of customers to scale addressable memory sizes of existing
servers for business-critical in-memory workloads such as real-time analytics.
The combined solution of AMD EPYC

processors with the Ultrastar DC ME200 Memory Extension Drive
expands
memory footprints at a higher memory-per-core ratio, in a scalable and
cost-effective way.


Western Digital is exhibiting
at RedisConf19, April 2-3, 2019 in San Francisco on Pier 27, Booth #19, and
will showcase how the Ultrastar memory drives can help cloud architects and
DevOps leverage memory drive technology in a variety of servers and
industry-leading processors to scale Redis
in-memory data
sets for larger memory pools with lower TCO. The Redis community will also
learn how they can optimize Redis data management and operations for
containerized microservices, conduct Redis backups, deploy multi-cloud
architectures, and build innovative applications for web-scale performance.


“For customers needing access to a broader memory
footprint at a higher memory-per-core ratio, a server using AMD EPYC processors
and Ultrastar memory drives can significantly scale addressable memory sizes of
existing and new servers for in-memory applications and databases,” said Raghu
Nambiar, CVP & CTO, datacenter ecosystems and application engineering, AMD.
“This means that customers can achieve increased productivity with additional
cost savings from greater addressable memory density, as well as reduced data
center operations and resource consumption.”


Introduced
in October 2018, the Ultrastar DC ME200 Memory Extension Drive is drop-in ready
and PCIe-device compatible for scalable in-memory computing to address higher
application performance needs and increasingly dynamic workloads and
architectures. The latest version of the Ultrastar memory drive now supports
AMD EPYC processors so cloud architects, DevOps leaders and digital platform
managers can accommodate ever-growing data sets onto larger memory pools by
augmenting DRAM without
requiring changes
to existing Linux® OS and application stacks.




The Ultrastar DC
ME200 Memory Extension Drive improves the AMD EPYC processor-based server
memory-to-core ratio compared to conventional scale-out DRAM compute clusters
using only DIMMs. The memory expansion scalability of the Ultrastar memory
drives also enables lower TCO of in-memory infrastructure through
consolidation. For example,
a cluster holding 30TiB of data in memory, using 30
nodes of 1TiB each, can be reduced to only eight nodes with 4TiB system memory
each, with the added benefit of increased per-node CPU utilization.1
The Ultrastar memory drive is an ideal solution for in-memory
database engines like SAP® HANA®, Oracle®, IBM®, and Microsoft®, as well as
scale-out memory-centric architectures, such as, Redis,
Memcached, Apache Spark™ and large-scale databases.


“AMD EPYC processor-based
servers, combined with Ultrastar memory drives, can greatly increase the amount
of overall memory per server to provide more cost-effective data center
infrastructure for in-memory applications,” said Eyal Bek, vice president, data
center and client computing devices at Western Digital. “We are deeply
committed to working with partners like AMD to improve the ability of digital
business customers to grow data sets without the imposing data center
infrastructure costs.”




MEMS Chip Accelerometer With High-Accuracy Temperature Sensor
EV Group And Panasonic Team Up On Resist Processing Solution
ON Semiconductor And GLOBALFOUNDRIES Partner To Transfer Ownership Of NY 300 Mm Facility
Qualcomm And Apple Agree To Drop All Litigation
Pfeiffer Vacuum Introduces New High-Performance Roots Vacuum Pumps
AP&S Participates In IPCEI
Infineon Manufactures 1000 A Voltage Regulator Solution For Next Generation AI And 5G Networking
Atomic-scale Memristive Devices: Small, Smart And Scalable
TÜV SÜD And DFKI To Develop “TÜV For Artificial Intelligence”
New Measuring Method Discovers And Understands Electromigration In Chips
A*STAR And Soitec Announce Joint Program
Synopsys Establishes Centre Of Excellence With STMicroelectronics
Samsung Successfully Completes 5nm EUV Development
Trymax Launches A Brand-New UV Curing And Charge Erase Product Line
Trymax Signs Strategic Financial Partnership With NIBC Bank
DRAM Market To Shrink Substantially In 2019
Edwards Launch IXH Mk2 Dry Pump For Ultra Harsh Semiconductor Processes
Keysight Integrates PathWave With Samsung’s 28FDS Process Design Kit
Edwards Launches New IXH Mk2 Dry Pump
Technoprobe To Acquire Microfabrica
Lumotive Launches High-Performance LiDAR For Autonomous Vehicles
Western Digital And AMD Address Memory Scaling Demand For Fast-Growing In-Memory Computing Workloads
TowerJazz Announces Three-Year Agreement Extension With Panasonic Semiconductor
Cadence Collaborates With TSMC To Accelerate 5nm FinFET Innovation

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info