Info
Info
News Article

Plasma Etching – NE-550, NLD-570, NE-5700, NE-7800, NLD-5700

News

ULVAC offers dry etching systems for MEMS, compound semiconductors, power devices, LED, RF devices, optical films and ceramics. More than 700 system installed are evidence in dry etching knowledge, quality and reliable process results.
The NE-5700, NE-7800, NLD-5700 etching systems for high volume mass production are available as four core and six core cluster platforms from single chamber up to four chamber system and up to two vacuum cassette chambers including ICP etching and ashing. The NE-550 and NLD-570 etching systems for R&D are equipped with one process chamber and single wafer vacuum load lock or vacuum cassette.

NE series offers the best RIE process in LED, RF Device, SiC, metal (Al, Al alloy, Mo, Ti, Ta, Ru, W, Cr), noble metal (Pt, Ir, Au), III-V Materials (GaN, AlGaN, InP, GaAs, AlGalnP), and Ferro-Electric Materials (PZT-stack, AlScN-stack, STO, BST), ITO, Al2O3, SiC, Diamond. For metal etching a stable etching rate can be achieved using ULVAC`s patented star electrode design.
For none volatile etching components the NE etching chamber is equipped with high temperature control of shields, chamber, gate valve, TMP and piping.
High selective etching between thick ferroelectric layer and thin bottom electrode can be achieved without side wall deposition to avoid deterioration of the electrical properties of ferroelectric capacitors in production. For Al etching the NE-7800R system can be equipped with Al etching chamber, dry ashing chamber and two atmospheric chambers for rinsing and wet resist removal to avoid any post etch corrosion.

NLD series offers the best RIE process for SiO2 trench etching (vertical or taper) for optical MEMS and wave guides; quartz and glass (Pyrex, fused glass, Borsilicat) etching for BIO-MEMS, smooth sidewalls Si-vias etching for packaging and etching of LiNBO3 for SAW.

Both, NE and NLD etching chambers are available for 100~200mm wafer size including perfect wafer temperature control using mechanical clamping or ESC. For the control of the etching uniformity both systems have low pressure operation below 0.1Pa with High Plasma Density of 5E10~1E11/cm-3 @ 0.1Pa Ar-plasma and low electron temperature of 3~5eV.
All systems can be equipped with wafer ID reader and SECS/GEM as option.

All offer low CoO, good maintainability, small footprint, superior process performance with Japanese quality and are locally supported by an extensive European operation. Located near Munich, our team of experienced engineers and sales people ensure a fast and professional response to customer requests. Request a free demo today.

https://www.ulvac.eu/en/products/equipment/by-technology.html



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event