SET Introduces New Automatic Flip-chip Bonder
Smart Equipment Technology (SET), a supplier in high accuracy die-to-die and die-to-wafer bonders has announced the release of NEO HB.
An automatic flip-chip bonder, the NEO HB has been designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM) and is suitable for direct hybrid bonding processes.
The first of a new line of flip-chip bonders dedicated entirely to production, the tool combines high precision, flexibility, short cycle time, and creative design. It was developed in collaboration with CEA-Leti as part of IRT Nanoelec's 3D integration program.
“SET joined IRT Namoelec in 2016 with the goal to develop a brand-new tool for direct-bonding applications that delivered high accuracy and high throughput, and a high level of cleanliness,” said Pascal Metzger, CEO of SET. “That ambition required a strong collaboration among experts from different disciplines. The commercial launch of NEO HB, which meets the initial technical targets. will address development and production needs for tomorrow's chips.”