+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Soitec announces joint development program with Applied Materials

News

Soitec, a semiconductor materials company based in Grenoble, France, has announced a joint development program with Applied Materials on next-generation silicon carbide substrates. Demand for silicon carbide-based chips has been rising, particularly in electric vehicles, telecommunication and industrial applications; however, adoption has been limited due to challenges related to supply, yield and cost of silicon carbide substrates. Soitec will be working with Applied Materials to develop substrates that can overcome these challenges and bring increased value to the industry.

The development program will combine Soitec’s experience in engineered substrates with that of Applied Materials, developer of materials engineering solutions. Whilst Soitec will leverage its proprietary Smart Cut technology - currently in use for the manufacture of Silicon-On-Insulator (SOI) products largely adopted by chip makers, Applied Materials will bring process technology and equipment expertise.

Under the development program, the companies will install a silicon carbide engineered substrate pilot line at the Substrate Innovation Center located at CEA-Leti. The line is expected to be operational by the first half of 2020, with the goal of producing silicon carbide wafer samples using Soitec’s Smart Cut technology in the second half of 2020.

“We are excited about forming this industry-unique strategic development program with Applied Materials,” said Thomas Piliszczuk, Executive Vice-President of Strategic Office at Soitec. “We are convinced that Soitec’s Smart Cut technology and 30 years of experience, together with Applied Materials’ great leadership in materials engineering, can enable the development of a robust technology and boost the silicon carbide supply chain,” added Piliszczuk.

“We look forward to working closely with Soitec to create materials engineering innovations for silicon carbide technology,” said Steve Ghanayem, Senior Vice-President of New Markets and Alliances at Applied Materials. “With its broad portfolio and deep expertise, Applied Materials is best positioned to help the power electronics industry overcome the toughest technology challenges.”

“Electric vehicles are a key focus for Audi. The future of mobility will be electric – based on technology innovations beginning at the semiconductor material and substrate level,” said Berthold Hellenthal, head of Competence Center Electronics and Semiconductors and the Semiconductor Strategy at AUDI AG. “Silicon carbide can enable higher power density and better efficiency semiconductors in electric vehicles. We are pleased to see Soitec and Applied Materials working together to advance this technology.”

Photonis announces agreement to acquire Xenics, a leader in Infra-Red imaging solutions
Phlux Technology Secures £4m in Seed Funding
Start-ups: build up your ecosystem
Trends in the semiconductor industry
Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects
Xenics introduces Wildcat+ 640
Advantest Introduces New inteXcell Series
Sony Semiconductor Israel Redefines IoT Connectivity Platform
Sensor Sales Stay Strong Due to Big ASP Rise
Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
Lam Research Acquires SEMSYSCO to Advance Chip Packaging
Infineon planning a major investment in a new factory in Dresden
Particle Measuring Systems introduces 10 nm aerosol particle counter
EBARA presents DYNOX Gas Abatement System
TSMC Launches OIP 3DFabric Alliance
DuPont reshapes IC materials manufacturing for post-COVID success
Evolving subfab vacuum challenges demand collaborative solutions
Next-gen low-k films can address present, future fabrication challenges
Critical Manufacturing redefines semiconductor MES for greater agility, success
Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Cutting FOPLP pattern distortion
EV Group advances leadership in optical lithography
ASM joins semiconductor climate consortium
KLA Launches New Double-Sided Direct Imaging Platform
Micron ships advanced DRAM technology with 1β node
Nor-Cal will do business as Pfeiffer Vacuum
ClassOne Equipment Releases Major New Lot of Used Semiconductor Tools for Resale
Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
Amkor to support European semiconductor ecosystem
Nanometre components require sub-nanometre precision
ALD TechDay for More-than-Moore devices
Cadence Expands Collaboration with Samsung Foundry

{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: