+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

ULVAC and Silex Microsystems Sign Joint Development Agreement for MEMS

News

ULVAC, Inc. (ULVAC), headquartered in Kanagawa, Japan and lead by CEO Setsuo Iwashita and SILEX Microsystems AB (Silex), headquartered in Järfälla, Sweden and lead by CEO Edvard Kälvesten, have announced they have signed an agreement to develop a production thin film piezoelectric process (PZT) for MEMS actuators and sensors with cutting edge performance and reliability.

Silex Microsystems, a World leading MEMS foundry, has more than a decade of experience working with PZT and has now selected ULVAC's SME-200 sputtering system for the mass production of MEMS devices. With the growth of MEMS technology, sensors and actuators that use piezoelectric device have been developed and commercialized in recent years. ULVAC believe that MEMS manufacturing technology, such as thin-film deposition and dry etching will be the key factor in producing high quality piezoelectric devices in the years to come.

Photonis announces agreement to acquire Xenics, a leader in Infra-Red imaging solutions
Phlux Technology Secures £4m in Seed Funding
Start-ups: build up your ecosystem
Trends in the semiconductor industry
Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects
Xenics introduces Wildcat+ 640
Advantest Introduces New inteXcell Series
Sony Semiconductor Israel Redefines IoT Connectivity Platform
Sensor Sales Stay Strong Due to Big ASP Rise
Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
Lam Research Acquires SEMSYSCO to Advance Chip Packaging
Infineon planning a major investment in a new factory in Dresden
Particle Measuring Systems introduces 10 nm aerosol particle counter
EBARA presents DYNOX Gas Abatement System
TSMC Launches OIP 3DFabric Alliance
DuPont reshapes IC materials manufacturing for post-COVID success
Evolving subfab vacuum challenges demand collaborative solutions
Next-gen low-k films can address present, future fabrication challenges
Critical Manufacturing redefines semiconductor MES for greater agility, success
Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Cutting FOPLP pattern distortion
EV Group advances leadership in optical lithography
ASM joins semiconductor climate consortium
KLA Launches New Double-Sided Direct Imaging Platform
Micron ships advanced DRAM technology with 1β node
Nor-Cal will do business as Pfeiffer Vacuum
ClassOne Equipment Releases Major New Lot of Used Semiconductor Tools for Resale
Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
Amkor to support European semiconductor ecosystem
Nanometre components require sub-nanometre precision
ALD TechDay for More-than-Moore devices
Cadence Expands Collaboration with Samsung Foundry

{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: