News Article

Security Lithography Advances To Thwart IC Counterfeiting


Multibeam Corporation, Dr. David K. Lam disclosed "Security Lithography" advances at the SPIE Advanced Lithography conference within the broader conference program titled, "Multicolumn E-Beam Lithography for IC Traceability," Dr. Lam will discussed how Security Lithography, made possible by Multibeam's MEBL, will thwart IC counterfeiting by embedding a unique ID into each IC during routine wafer fabrication.

"Counterfeit ICs remain a major problem throughout the semiconductor supply chain," asserted Dr. Lam. "Each critical IC should have a unique tamper-proof identifier to enable verification of authenticity throughout its life cycle, but current anti-counterfeit solutions are costly and fall far short of expectations."

In his presentation, Dr. Lam contrasted current approaches with the use of MEBL, which can embed a unique ID deep inside each IC during normal fabrication; hard-code the ID at the 'silicon level' making it virtually tamper-proof; eliminate the need for costly drive circuits, extra mask steps, and/or special packaging; and can link to a secure database to store individual chip data including chain-of-custody records, which is crucial for verifying provenance of the chip.

"Faster, Better, Cheaper" Still Essential but Insufficient"

Winners in today's IC market need to go beyond making chips faster, better and cheaper," affirmed Dr. Lam. "Winning must now include 'more secure' as counterfeit ICs proliferate and negatively impact IC makers as well as commercial and government users." He stressed the need to embed each chip with a unique ID during wafer fab, a task just not possible with cookie-cutter mask-based lithography such as DUV and EUV. He reported that his firm's multi-module MEBL system (with each module about the size of a plasma-etch module) has advanced to writing on-chip security at a throughput of 60 wafers/hour. "Such a high rate is compatible with most wafer fab flows and affordable for commercial chipmakers," he added. "Expect Security Lithography to address hugemarkets as the need for on-chip security cuts across most applications."

Imec Builds World’s First Spiking Neural Network-Based Chip For Radar Signal Processing
Picosun Group’s Strong Growth Continues In 2020
Structural Defects In A TO-220
Oxford Instruments’ Plasma Technology And NanoScience Businesses Collaborate With The Consortium
The AP&S Demo Center Will Help You. Request Your Wet Process Demonstration And Be Part Of It Live Via Video Chat.
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
Park Systems Announces $1 Million Dollar Nano Research Grant Fund
SUSS MicroTec Purchases The Inkjet Printer Division Of Meyer Burger B.V.
Picosun And A*STAR’s IME To Create Novel, High Performance Memories
The ASM 306 S Helium And Hydrogen Sniffer Leak Detector For Easy And Accurate Full-time Sniffing Operations
ACM Research Launches Stress-Free Polishing Tool For Advanced Packaging Applications; Delivers First Tool To Leading Chinese OSAT
Semiconductor Manufacturing: Achieving Water Authority Compliance
WEBINAR: Smart Manufacturing
Intel Shines Amidst The Carnage Of The 2019 Semiconductor Market
Picosun Reinforces Local Operations During The COVID-19 Epidemic
SPTS Technologies Honored With Queen’s Award For Enterprise In Innovation 2020
Park Systems Completes Equity Investment In Molecular Vista
Particle Measuring Systems Releases 20 Nm Syringe Sampler
Ereztech Expands US Footprint, Opens R&D Lab
Imagination Technologies Commits To The UK As It Looks To Accelerate Growth In New Areas Of Technological Innovation
Efinix’s Trion FPGA Silicon Platform Expands Into Europe
Infineon Technologies AG Completes Acquisition Of Cypress Semiconductor Corporation
Dow Launches Fast Curing Silicone Adhesive
Infineon Withdraws Outlook For FY20

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: