News Article

Thermo Scientific Adds To Failure Analysis Portfolio


New platform provides faster identification of defects that impact device performance

Thermo Fisher Scientific has released the nProber IV nanoprober platform, a fault isolation system used by semiconductor fabs to precisely locate and characterise nanometer-scale electrical faults that impact device performance and reliability.

According to the company, the nProber IV is the highest performance nanoProber in the Thermo Scientific portfolio, specifically targeted at advanced logic and memory. It is designed to complement its other SEM-based solutions that address the nanoprobing needs of failure analysis of compound semiconductors such as GaAs, GaN, SiC.

"As an established leader in failure analysis, we know companies investing in nanoprobing dramatically improve their fault analysis workflows, and the nProber IV platform offers our highest technical performance to date," said Glyn Davies, vice president and general manager of semiconductor at Thermo Fisher. "Semiconductor manufacturers will save time and money by more quickly identifying defects that impact device performance, allowing them to bring better products to market even faster."

Online Event Globalizing The Power Of Digital Olfaction Through Standards & Protocols
Onto Innovation Announces New Inspection Platform
Park Systems Announces NanoScientific Symposium Asia - November 24-25 2020
Picosun’s Medical ALD Solutions Enable Safer Surgeries
IQE Develops Path For VCSEL Growth On Silicon
Picosun’s Success Brings Chairman Of The Board National Entrepreneur Award Of Finland 2020
Silicon Wafer Shipments Slip In Third Quarter 2020 But Strong For Year
EV Group Establishes State-of-the-art Customer Training Facility
Deca Announces Chiplet Advanced Packaging Partnership With ADTEC
EV GROUP Unveils Hybrid Die-to-wafer Bonding Activation Solution
K-Space Offers A New Accessory For Their In Situ Metrology Tools
PICOSUN Sprinter Disrupts Fast Batch ALD On 300mm Wafers
3D-Micromac Unveils Laser Annealing System For Magnetic Sensor Manufacturing
ACM Research Enters 3D TSV Copper Plating Market
DISCO's Completion Of New Building At Nagano Works Chino Plant
Prestigious ERC Consolidator Grant Awarded To Imec
Advanced Process Solutions For Industry Leaders
Dialog Semiconductor Licenses Its Non-Volatile Resistive RAM Technology To GLOBALFOUNDRIES
AP&S Expands Management At Beginning Of 2021
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Will Future Soldiers Be Made Of Semiconductor?
EV GROUP Addresses Key Process Gap In Heterogeneous Integration
Pfeiffer Vacuum Presents New Turbopumps HiPace 350 And HiPace 450
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array