News Article

Scientech And Trymax Partner To Distribute Resist Ashing And UV Products In Taiwan


Trymax Semiconductor Equipment BV, a supplier of semiconductor plasma technology, and Scientech, have entered into a distribution agreement for Taiwan. The agreement gives Scientech Corporation the right to distribute all of Trymax's NEO ashing, etching products and their latest UV curing and charge erase products.

This agreement with Trymax will assist Scientech in expanding its business in the segment of high speed communication, 3D sensing including ToF, high frequency power devices and related device markets. Scientech offers extensive experience in introducing the highest quality equipment from around the world and will provide world-class technical and field support for Trymax products after system delivery.

“A partnership with Scientech is a critical component for our expansion strategy in Taiwan” stated Ludo Vandenberk, Executive Vice President of Trymax Semiconductor Equipment. “By combining forces with Scientech, we are able to better serve the front-end, MEMS and back-end manufacturers with solutions that span the ashing, descum and lite etch process steps as well as the UV curing and charge erase applications. We are eager to get started serving our customers with the competitive advantages that our technologies can offer.''

“With Trymax's expertise and cost-effective solution, we are very grateful to cooperate with Trymax to support the customers in the semiconductor field, which is not only to enhance our coverage of front-end production but also to strengthen our customers' competition in the arena.” commented Peter Kuo, Vice President Representative Div. II at Scientech Corporation.

Trymax's NEO products for ashing, etching and descum serve the semiconductor industry for 150mm, 200mm and 300mm substrates. Our bridge tools are fully flexible for processing multiple different substrates types like Si, GaAs, SiC, LiN, LiT, eWLB and Taiko wafers from R&D to high volume production. We offer optimized solutions based on the best cost of ownership in combination with the maximum flexibility. All Trymax platforms are configured with a fully digital onboard communication system with up to 5 different process chamber technologies selectable.

The UV curing and charge erase equipment from Trymax is used for a wide range of applications that includeing photo-stabilization of the resist prior implantation or etch, for small CD, or to erase charge built-up during the IC manufacturing process. The NEO 2000UV has been designed taking advantage of the reliable NEO platforms developed by Trymax for plasma ashing, descum, and etching applications. The NEO 2000UV is implementing state-of-the-art robotics, components, the latest digital technologies and software, and is CE compliant. NEO 2000UV can accommodate cassettes or SMIFs.

Global Semiconductor Sales Increase 4.9 Percent
SUSS MicroTec And DELO Collaborate On Imprint Lithography
ACM Research Enters 3D TSV Copper Plating Market
IQE Develops Path For VCSEL Growth On Silicon
ACM Research Highlights WLP Processing Equipment For OSAT Customers
Multibeam To Develop Full-Wafer, All-Maskless Patterning At 45 Nm
Advanced Process Solutions For Industry Leaders
Dialog Semiconductor Licenses Its Non-Volatile Resistive RAM Technology To GLOBALFOUNDRIES
EV GROUP Addresses Key Process Gap In Heterogeneous Integration
3D-Micromac Unveils Laser Annealing System For Magnetic Sensor Manufacturing
Detection Technology Launches X-Panel 1412
IMT Modernizes MEMS Foundry Services With Plasma Etch Solution
Picosun’s Success Brings Chairman Of The Board National Entrepreneur Award Of Finland 2020
Webinar: AC Power Control: Configurable /flexible /robust Hardware Based Controller Solutions
Panasonic Completes Transfer Of Semiconductor Business To Nuvoton
EV Group Brings Maskless Lithography To High Volume Manufacturing
SINGULUS Receives Order From Leading Semiconductor Foundry
ULVAC Techno Offers Equipment Support In Japan And East Asia
Silicon Wafer Shipments Slip In Third Quarter 2020 But Strong For Year
Park Systems Announces NanoScientific Symposium Asia - November 24-25 2020
Picosun’s Medical ALD Solutions Enable Safer Surgeries
Deca Announces Chiplet Advanced Packaging Partnership With ADTEC
Keep Calm And Carry On – Covid 19 And The Semiconductor Industry
IGBT Modules Interrogated Acoustically

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: