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Advanced Process Solutions For Industry Leaders

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RENA Technologies North America (RENA NA), experts in Wet Processing of Compound Semi Materials, provides our customers in high technology Advanced Process Solutions.

RENA NA's Technical Sales Teams were able to procure several million dollars in orders by quickly identifying critical requirements. With their process experience, RENA NA was able to provide systems to meet each customer's needs confidently.
A global recording head manufacturer who is building a brand-new pilot line for 200mm wafers required a vendor to manufacture a large number of wet process tools. The applications for RENA NA's equipment include wet etching, metal liftoff, photoresist development, Marangoni drying, IPA vapor drying, and spin rinse drying. Fast turnaround to meet the customer's expansion deadlines was critical.
RENA also received an additional $1M+ order from a digital device manufacturer, for their new Micro/Mini LED product line. RENA NA's strong experience with Au and TiW etching applications meant the Revolution semi-auto wet bench, equipped with TruEtch tanks for Au and Ti, provides good etch uniformity, is more productive (WPH), and costs less than single wafer processing wet or dry etching alternatives.
Scott Tice, RENA NA's Director of Process Applications Engineering explains, “Micro/Mini LED is one of the fastest growing compound semiconductor market segments today. Manufacturing these devices requires precision etching in higher volumes at the lowest possible cost. The Revolution, with its patented TruEtch Technology tanks, delivers the right performance at the right cost for this growing market. By leveraging our applications lab in Albany Oregon, we have developed the experience and data which demonstrate our TruEtch capabilities for precision etching of Au and Ti layers. This bi-metal combination etch application is fundamental to the manufacturing process for these devices. RENA is well positioned and very pleased to be partnered up with leaders in the race for market dominance in Micro/Mini LED devices.”



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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VIEW SESSIONS
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