Info
Info
News Article

Tokyo Electron Announces PICP Pro Plasma Etch Systems

News

*PICP: A plasma module that generates highly uniform, high-density plasma on a panel substrate.

Tokyo Electron (TEL) has announced the launch of Impressio 1800 PICP* Pro and Betelex 1800 PICP Pro, the company's latest plasma etch systems featuring the new PICP Pro chamber for high resolution processing of 6th generation (G6: 1,500 mm x 1,850 mm) glass substrates.

In the G6 display segment where smartphones are the main application, the wider adoption of high resolution OLED is expanding, and further innovations enabling lower power consumption and smarter user interfaces are eagerly awaited. Such innovative technologies would require densely packed circuit patterns, which calls for more rigorous control capabilities in manufacturing equipment than ever before.

In response to these market demands, TEL has developed PICP Pro, which offers a new capability to control the plasma-space-generating area while retaining the high-precision etch performance of TEL's proprietary PICP high-density plasma source. The newly added capability reduces the generation of particles that adversely affect maintenance and yield, achieving lower running costs than those for previous PICP.

“PICP Pro is TEL's original development considering our customers' true needs in their mass-production lines,” said Hiroshi Ishida, FPD Business Unit General Manager at TEL. “PICP Pro offers superior etch precision and higher yield in the advanced display segment.”




AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Thermo Scientific Offers A Leap Forward For Advanced Materials Characterization
Siemens And ASE Introduce Enablement Technologies For High Density Advanced Package Designs
Merck KGaA Silicon Valley Innovation Hub To Intermolecular Site
Superconducting Chips To Scale Up Quantum Computers And Boost Supercomputers
Cast Aluminum Solutions Launches Industrial Heater
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips
Panasonic Microelectronics Web Seminar
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Quantum Computing Breakthrough Shows Blueprint For Scalable Future
AP Memory And Ambiq Partner
Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry
Hamamatsu Develops Rapid Micro-LED Inspection Tool
Macronix Provides Advanced Flash Memory To STMicro
Tokyo Electron Announces PICP Pro Plasma Etch Systems
Xilinx Expands Into New Applications
Applied Materials Introduces New Playbook For Process Control
Imec Demonstrates 18nm Pitch Line/Space Patterning
Cadence Unveils Next-Generation Palladium Z2 And Protium X2 Systems
Picosun Trusts In Augmented Reality For Refined Customer Support
Brewer Science Recognized As Outstanding Exporter
Picosun Group Demonstrates Strong Growth In 2020
EMD Performance Materials Announces Further Investment

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event