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Picosun Trusts In Augmented Reality For Refined Customer Support


During the past year, organizations worldwide have been forced to adapt to new ways of working and serving their customers due to the covid-19 pandemic and the related restrictions to travel and logistics. Picosun Group has significantly reinforced its local service units globally and established its PicoSupport Center.

PicoSupport Center provides on-site support and planned service items such as ALD system installations and preventive maintenance visits conducted by highly experienced, trained and certified field service engineers. It also takes care of customers' Helpdesk and Emergency Service operations.

At the core of PicoSupport Center's Helpdesk are state-of-the-art remote support tools taking advantage of augmented/mixed reality, live video, screensharing and remote connection applications. In accordance with Industry 4.0, these tools allow safe and on-time service delivery no matter the physical location or time zone of the customer. They also offer an endlessly upgradeable platform for further embedding of e.g. remote training and e-learning modules with full virtual reality environments.

Today, the remote support tools are already widely implemented in Picosun's customer base. The remote applications are used for a number of services ranging from system inspections and troubleshooting to software upgrades, bug fixes and process optimizations.

“I'm very proud to say that we have been able to adapt to the changing environment by employing new ways of interaction to ensure continued customer satisfaction. The feedback on the new remote support applications has been very positive. Customers find them easy to use and have benefitted from them in terms of faster reaction times and lower costs compared to traditional on-site services,” says Timo Malinen, VP, Service Business Area of Picosun Group.

“As our customers' trusted strategic ALD partner we are committed to top-notch and uninterrupted services, despite of the changes in the world we operate in. We are looking forward to further enhance and develop the ways with which we can ensure smooth and trouble-free operations together with our customers,” Malinen concludes.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Cast Aluminum Solutions Launches Industrial Heater
Brewer Science Recognized As Outstanding Exporter
Xilinx Expands Into New Applications
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Merck KGaA Silicon Valley Innovation Hub To Intermolecular Site
Cadence Unveils Next-Generation Palladium Z2 And Protium X2 Systems
Quantum Computing Breakthrough Shows Blueprint For Scalable Future
Superconducting Chips To Scale Up Quantum Computers And Boost Supercomputers
Thermo Scientific Offers A Leap Forward For Advanced Materials Characterization
AP Memory And Ambiq Partner
Hamamatsu Develops Rapid Micro-LED Inspection Tool
Picosun Trusts In Augmented Reality For Refined Customer Support
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips
Macronix Provides Advanced Flash Memory To STMicro
Applied Materials Introduces New Playbook For Process Control
Siemens And ASE Introduce Enablement Technologies For High Density Advanced Package Designs
Picosun Group Demonstrates Strong Growth In 2020
Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Imec Demonstrates 18nm Pitch Line/Space Patterning
Panasonic Microelectronics Web Seminar
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
EMD Performance Materials Announces Further Investment
Tokyo Electron Announces PICP Pro Plasma Etch Systems

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