Info
Info
News Article

Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry

News

Brewer Science, Inc., in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, today announced that its division formerly known as “Printed Electronics” has expanded and is now its “Smart Devices & Printed Electronics Foundry.”

Brewer Science combines materials science expertise, printed flexible electronics technology, and firmware development capabilities to deliver flexible hybrid electronic (FHE) products that deliver actionable data required for today's sophisticated IIoT environments. The expanded Smart Devices & Printed Electronics Foundry now offers a full range of electronics platforms, including sensors and systems, that are easily integrated into existing processes and products, such as foundry services, printed temperature sensors, water quality sensors, and condition-monitoring sensors. The complete end-to-end services range from small-scale prototyping and sensor manufacturing to user interface design, security protocols, as well as data-to-cloud capabilities.

“Brewer Science continues to push the boundaries of what is possible. Cutting-edge materials science and innovative process development are at the core of the company's 40-year history. By expanding into smart devices and printed electronics, we are leveraging our knowledge and experience in microelectronics to deliver smart sensor systems and real-time data to our customers,” said Dr. Adam Scotch, Director of R&D, Smart Devices and PE Foundry.

Showcasing its cutting-edge technology, Brewer Science exhibited its FHE capabilities at the FLEX 2021 Virtual Conference February 22 through 26, and will exhibit at the LOPEC International tradeshow in Messe Munchen, Germany, March 23 through 25. Ryan Moss, Director of New Business Development at Brewer Science, and Jonathan Fury, Director of Printed Electronics at Brewer Science, will be presenting their research, “Enabling IIOT Applications in Water Sensing.”



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Macronix Provides Advanced Flash Memory To STMicro
Tokyo Electron Announces PICP Pro Plasma Etch Systems
Xilinx Expands Into New Applications
Hamamatsu Develops Rapid Micro-LED Inspection Tool
Panasonic Microelectronics Web Seminar
Quantum Computing Breakthrough Shows Blueprint For Scalable Future
Cast Aluminum Solutions Launches Industrial Heater
Merck KGaA Silicon Valley Innovation Hub To Intermolecular Site
AP Memory And Ambiq Partner
Imec Demonstrates 18nm Pitch Line/Space Patterning
Superconducting Chips To Scale Up Quantum Computers And Boost Supercomputers
Cadence Unveils Next-Generation Palladium Z2 And Protium X2 Systems
Brewer Science Recognized As Outstanding Exporter
Thermo Scientific Offers A Leap Forward For Advanced Materials Characterization
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
EMD Performance Materials Announces Further Investment
Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry
Picosun Trusts In Augmented Reality For Refined Customer Support
Picosun Group Demonstrates Strong Growth In 2020
Applied Materials Introduces New Playbook For Process Control
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Siemens And ASE Introduce Enablement Technologies For High Density Advanced Package Designs

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event