News Article

Henkel 3D Printing Facility Drives Sustainability By Achieving Zero Waste To Landfill Status


Henkel's Dixon facility in California, USA, for the manufacture of resins for 3D printing, has achieved zero production waste to landfill (ZWTL) status.
The production waste at the site includes a variety of non-hazardous materials including cardboard, paper and other packaging materials, which are recycled. Until recently, other materials that were not as easy to recycle were sent to landfills. With the development of new capabilities and business processes, Henkel validated that its vendor could process additional materials for energy recovery, enabling the facility to completely reach its goal for ZWTL.

“Waste reduction is commonly thought of as one of the big benefits of additive manufacturing”, says Jake Kisner, Operations Manager, 3D Printing at Henkel. “However, the major focus today is on a narrow part of the supply chain. Certainly, there is less waste in production when comparing additive with a subtractive technology like machining, but there are also opportunities upstream, before a job is ever printed.”

Henkel's sustainability strategy is to add value through its business activities while reducing its environmental footprint. By 2030 the company plans to triple the value it generates from its products and services, while simultaneously striving to become more efficient in its approach to operations, focusing on three key areas including “energy and climate,” “materials and waste” and “water and wastewater.”

“We are committed to fulfilling our sustainability promise,” says Kisner. “From a materials and waste perspective, we are working to reduce resource consumption, leverage renewable raw materials, and streamline our packaging to minimize waste. But we're also keenly focused on improving our recycling efforts. Achieving ZWTL status at the Dixon facility demonstrates our 3D printing team's resolve in helping Henkel achieve its environmental goals. Not only did we have to identify all the materials we were sending to landfills and find a way to recycle them, we also had to create and implement new processes. The motivation and contributions from our employees were evident. They were excited to impact change, both within our company and for society as a whole.”

Achieving ZWTL status is a global initiative, and already more than 66% of Henkel's Adhesive Technologies production facilities worldwide have reached ZWTL status including eight in the U.S. The team at Dixon created a solution that is truly scalable, and as the additive manufacturing business grows within Henkel, the impact becomes even more profound. While there are some unique processes involved with the manufacture of 3D printable resins, there are many best practices that can be implemented at other facilities, and beyond Henkel, there is also opportunity for the additive manufacturing industry as a whole.

AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Kenneth Hörhammer Joins Picosun As Vice President, Sales
Cadence Unveils Next-Generation Palladium Z2 And Protium X2 Systems
Park Systems Hits 1 Trillion KRW Mark At KOSDAQ
EU Project To Mimic Multi-Timescale Processing Of Biological Neural Systems
TESCAN New Delayering Capability For Unattended, Automated Failure Analysis
5G To Spur Growth Of GaN & SiC Semiconductor Market By 2027
Luvata Announces €34M Investment In Finland Hot Extrusion Line
Brewer Science Recognized As Certified B Corporation
Picosun Trusts In Augmented Reality For Refined Customer Support
Pfeiffer Vacuum Presents Extension To DigiLine Series
Brewer Science Recognized As Outstanding Exporter
OmniVision Automotive Image Sensors Compatible With NVIDIA DRIVE Platform
Xenics Introduces DIONE S 640
Allegro’s New Magnetic Position Sensor Enables Next-generation ADAS Applications
Reno Launches Series Of Integrated RF Power Systems At 7nm Or Below
Picosun Increases Efficiency For LED And OLED Production
Oxford Instruments Starts Construction Of New Facility
Quantum Computing Breakthrough Shows Blueprint For Scalable Future
Henkel 3D Printing Facility Drives Sustainability By Achieving Zero Waste To Landfill Status
PICOSUN Sprinter Demonstrates Record-breaking Batch Film Quality
Picosun Group Demonstrates Strong Growth In 2020
Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry
Esmo Raises The Bar For Automated Microchip Testing
Ensuring The Reliability Through Non-Destructive Testing

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array
Live Event