News Article

CleanSurF - AP&S New Cleanliness Guarantor For Carriers, Boxes, SMIFs And FOUPs


CleanSurF - the new AP&S cleaner ensures maximum cleanliness in accordance with highest purity standards to secure the process chains in semiconductor manufacturing and ensure maximum productivity.

The CleanSurF convinces with a loading capacity of up to 12 x 12 inch FOUPs per run at optimized recipe time. In combination with a compact footprint of approx. 3 square meters and a very low consumption of water and nitrogen, the CleanSurF® offers extremely attractive TCO values.

The CleanSurF concept is optimized for both manual and automatic loading. Two newly developed components make a decisive contribution to optimum particle and AMC (airborne molecular contamination) removal performance and shorter process times

  1. An innovative nozzle concept enables flexible, 360-degree, separately controllable handling of the nozzles. More than 50 nozzles (DIW as well as N2 nozzles) are installed in the tool and ensure optimum cleaning results.
  2. A new carousel design consisting of motor technology, robust rotating frames and flexible equipment fixtures offers new locking devices with additional safety functions. During manual loading, the rotating frame is firmly fixed, allowing convenient and fast loading.

The latest software technology including HMI according to Semi II standard, guarantees maximum process reliability. User-friendly monitoring ensures convenient and simple system handling. This includes: schematic display of the process chamber, of process values and active spray elements, as well as simple recipe management and a wide range of export functions.

The autarkic process chamber convinces with a large loading window. The clear design ensures maximum safety as well as simple installation and maintenance. Loading on the cleanroom side and access to the service area on the grayroom side means that valuable cleanroom space can be saved. As an option, a second process chamber door allows a gate function to separate the cleanroom from the grayroom.

The CleanSurF® extends the AP&S cleaner series, which so far has featured the CB II and CB III products. "In product development, the following were the key points for us: we wanted to develop a cleaner according to the latest technical standard, which enables both manual and automatic loading and increases the capacity of our existing cleaners. With our new CleanSurF®, we have achieved our goal to realize a cleaner with efficient throughput and attractive TCO," explains Tobias Bausch, CMO & CTO at AP&S.

AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


Xenics Introduces CERES T 640
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
Renesas And Syntiant Develop Voice-Controlled Multimodal AI Solution
Brewer Science Achieves ISO 45001:2018
Pfeiffer Vacuum Introduces The Reliable And Low-vibration HiPace 80 Neo Turbopump
Nordson Ships First SELECT Unit From New Global Manufacturing Facility
OmniVision Announces Industry’s First 8 Megapixel Medical-Grade Image Sensors For Single-Use And Reusable Endoscopes
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
EV Group Launches First Step And Repeat Mastering Services For Nanoimprint Lithography
Picosun’s PicoArmour Reduces Semiconductor Manufacturing Costs
5G Is A Game-Changer For Semiconductors
SiTime MEMS Oscillators Support Square Point-of-Sale Products
Winbond’s Successful Interoperability Of OctalNAND Flash With Synopsys DesignWare AMBA IP
ASM AMICRA Unveils Three New Manufacturing Systems
SiTime MEMS Timing Solution To Support Raytheon’s Precision Guidance System
Park Systems Announces Autonomous AFM With Built-in Intelligence
Picosun Strengthens Its Presence In Southeast Asia
Blaize Announces $71 Million Series D Financing
FormFactor Introduces Automated Cryogenic Wafer Probe System
Semiconductor IP Market To Reach USD $7 Billion By 2027
CleanSurF - AP&S New Cleanliness Guarantor For Carriers, Boxes, SMIFs And FOUPs
Tignis Simplifies Adding ML To Advanced Process Control Manufacturing Systems
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
DISCO Corporation's Completion Of Construction At Kuwabata Plant

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event