Info
Info
News Article

Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System

News

Leading-edge Technology Meets the Extreme Test Challenges of the Age of Convergence and Exascale Computing

Semiconductor test equipment supplier Advantest Corporation has announced its next-generation V93000 testers targeted at advanced digital ICs up to the exascale performance class. The systems' new test heads incorporate Xtreme Link technology, and the EXA Scale universal digital and power supply cards that enable new test methodologies, lower cost-of-test and faster time-to-market.

Today's most advanced semiconductor processes allow for technology transformations that enable real-time integration of data from a countless number of sources such as IoT and handheld devices, automobiles and large servers to name a few. As mobile processors, high-performance computing (HPC) and artificial intelligence (AI) ICs evolve, the amount of data being processed continues to grow exponentially. Along with these advancements, new testing challenges, including very high scan-data volumes, extreme power requirements, fast yield-learning, and high-multisite configurations, need to be addressed.

Advantest's new V93000 EXA Scale generation addresses these challenges with innovative advancements on the proven V93000 architecture. All EXA Scale cards are designed with the latest generation of Advantest's test processors with 8 cores per chip, featuring unique capabilities to speed up and simplify test execution. Furthermore, the V93000 EXA Scale system employs Advantest's patented Xtreme Link technology, a communication network designed specifically for automatic test equipment (ATE). The technology provides high-speed data connections, embedded computing power, and instant card-to-card communication.

The system's new Pin Scale 5000 digital card is designed to address the explosion of scan data volumes which are inherent to large digital designs. The Pin Scale 5000 is setting a new standard for scan test with 5Gbit/s speed, providing the deepest vector memory available on the market and using the Xtreme Link technology for the industry's fastest processing of results. With this technology, customers can choose the most efficient scan methodology for their device.

Very high current requirements up to several 1000A at supply voltages below 1V make power delivery capabilities of ATE a differentiating factor. The XPS256 power supply is another industry innovation, covering all power requirements with a single DPS card: fine-granular power, unlimited and flexible ganging and exceptional static and dynamic performance.

With 256 channels on the Pin Scale 5000 digital card and XPS256 power supply card, the density is doubled, while maintaining the industry-leading V93000 highly integrated form factor. High-multisite configurations can be implemented in smaller physical systems, reducing infrastructure cost and floor-space requirements.

“As we move into the era of exascale computing, the extreme test challenges that our customers are facing in the areas of performance, cost-of-test, quality and time-to-volume are all addressed with the innovations that EXA Scale brings to the time-tested V93000 platform,” said Juergen Serrer, managing executive officer and executive vice president, V93000 Business Unit at Advantest Corporation.

Scalable solutions extend across test heads of different sizes, including the ability to test a mix of device functions, like digital, RF, analog and power on one test system.

The V93000 EXA Scale generation renews Advantest`s commitment to platform compatibility. Existing V93000 load boards and Smart Scale cards are compatible, supporting a smooth transition to the V93000 EXA Scale generation and best asset utilization. With the continued use of the proven SmarTest software, customers benefit from the installed base software infrastructure and tooling.

Advantest has already shipped dozens of the V93000 EXA Scale systems to multiple industry-leading customers.



AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FREE

VIEW ON-DEMAND
Tektronix Releases Results Of Its Global Engineer Survey 2021
Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System
Path To Sensors Interoperability - IEEE SA Sensors Series Live Webinar
Pfeiffer Vacuum Introduces The Reliable And Low-vibration HiPace 80 Neo Turbopump
ACM Research Enters Bevel Etch Market To Support Emerging Process Steps In 3D NAND, DRAM And Advanced Logic Manufacturing
PragmatIC Semiconductor Secures $80 Million Funding
New OmniControl Universal Control Unit For Pumps And Measurement Instruments From Pfeiffer Vacuum
DISCO Corporation's Completion Of Construction At Kuwabata Plant
Sivers Semiconductors’ Japanese Customer Takes Step Towards Mass Production
Tignis Simplifies Adding ML To Advanced Process Control Manufacturing Systems
SiTime Enables Up To 25% Faster Wireless Charging
Edwards Opens Lab At Hillsboro Innovation Center
Merck Integrated Materials Solution Provider Launches Semiconductor Materials Webinar Series
Renault To Create Better Brand Visibility For Qualcomm In EV Market
Institute Microelectronics And Photonics Chooses Tektronix For Semiconductor Testing At Very Low Currents
Edwards Officially Opens New Flagship Service Technology Centre In Dublin
Xenics Expands Its Bobcat Product Family And Makes SWIR Cameras Affordable.
Excellent Batch Process Results With Picosun New Generation Tools
Picosun Strengthens Its Position In The Semiconductor Market
SkyWater Signs Technology Transfer And License Agreement With Deca
Linton Crystal Technologies Uses AI To Detect Crystal Structure Loss, Notify Operator
Pfeiffer Vacuum Presents A Cloud-based Solution For Service Management
PragmatIC Semiconductor Re-invents Iconic Processor
EV Power Electronics: Driving Semiconductor Demand In A Chip Shortage

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event