Info
Info
News Article

YES Acquires Kanthal’s Semiconductor Equipment Business

News

Kanthal LPCVD technology opens new deposition opportunities in optical, power and microLED applications

YES (Yield Engineering Systems), a manufacturer of process equipment for semiconductor packaging, life sciences and 'More-than-Moore' applications, has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.

Under the terms of the agreement, which was signed on October 6th, YES will take ownership of Kanthal's semiconductor-related capital equipment portfolio, system-related upgrades, and service needs. The acquisition will add Kanthal's high-temperature (>800°C) furnace technology as well as Low Pressure Chemical Vapour Deposition (LPCVD) processes to YES's growing capabilities in the thermal processing area.

“We aim to be the semiconductor industry's provider of choice for surface modification, material enhancement, and high-quality deposition,” said Rezwan Lateef, president of YES. “With this acquisition of equipment and technical expertise from a leader in industrial heating, we look forward to supporting our global customer base with new high-temperature annealing and bonding systems that leverage Kanthal heating equipment.

"In addition, we feel that the Kanthal LPCVD technology has potential to open exciting deposition opportunities for YES beyond our current monolayer coating systems, particularly in the areas of optical, power and microLED.”

ULVAC Expands Process Capability
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Mycronic Receives Order For An SLX Mask Writer
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
NTU Singapore Launches Quantum Science And Engineering Centre
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
ALD Is Taking Off In More-than-Moore Applications
The All-round Smart Proximity Sensor Chip
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
Edwards Launches New Cryopump
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
YES Partners With Osiris For Edge Film Removal Technology
CEA-Leti Unveils Navigation-Grade Gyroscopes
Park Systems Combines AFM With White Light Interferometry
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
BASF And Entegris Sign Agreement On Sale
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event