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News Article

New Brewer Science Bonding & Dielectric Materials Deliver Packaging Solutions For 5G, IoT Devices

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Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption. Brewer Science, a global technology leader in the development and manufacturing of innovative materials and processes, has introduced its latest packaging solutions utilizing a permanent bonding material and a photo-imageable dielectric for the fabrication of cutting-edge semiconductors as well as 5G and IoT microelectronic devices.

By Baron Huang, Mei Dong, and Ziwei Liu, Brewer Science

PermanentBonding Material with High Thermal Budget
Bonding two
components together permanently is applied inmany fields of advanced packaging to offer az-axis direction of integration for the fabrication of three-dimensionalintegrated circuits (3D ICs). Such permanent bonding techniques includedirect/fusion bonding, anodic bonding, soldering, and thermocompression. Whilefusion bonding is still the most frequently used permanent bonding technologyin today's semiconductor industry, there is a fast-growing trend for adhesivebonding.

Adhesive bonding, which developsa bond connecting one surface to another using a polymeric material as theintermediate layer, brings significant advantages including: 1) improved designflexibility; 2) good surface planarization and adaptability to surfacetopography; 3) lower bonding temperature for protecting sensitive components;and 4) better tolerance to particles. With all these merits, adhesivebonding has recently received much attention for microelectromechanicalsystems (MEMS) packaging and heterogeneous integration to assemble individualIC components such as logic chips, memory chips, and image sensor devicestogether into high-density, ultra-thin integrated packages. Such modules areneeded for high-performance computing applications such as artificialintelligence (AI), data centers, 5G, and high-end mobile products.

Brewer Science previouslyintroduced its first permanent bonding adhesive, the PermaSOL® family ofmaterials, at the European 3D & Systems Summit. PermaSOL materials were designed to address chip-level and wafer-levelpackaging requirements by providing reliable bonds with good thermalstability and with low moisture absorption. Brewer Science is now introducingits next generation of permanent bonding materials (PBM) with excellent thermalstability and an improved thermal budget up to 350°C. These materials furtherprovide room temperature bonding with low pressure, low dielectric constant,high chemical resistance, and long shelf life.

In comparison tobenzocyclobutene, a widely used bonding adhesive, the Brewer Science nextgeneration PBM exhibits even lower curing temperature, smaller tensile strengthand modulus, and larger CTE. These characteristics make the Brewer Sciencematerial a ‘super low-stress resin' providing the benefits of low warpage,which brings up promising opportunities for applications on flexiblesubstrates.

Next generation PBM exhibitsgood thermal stability with a decomposition temperature above 470°C in anitrogen atmosphere. The bonding can be achieved at 25°C, 2 kN, for 2 minutes,due to the intrinsic flexibility and fluidity of the material.