Automation in semiconductor test processes: a key factor in modern production

The automation of semiconductor test processes is a crucial factor in modern semiconductor production. It promises not only increased efficiency and cost reduction but also improved test accuracy and reliability. Despite the numerous advantages, manufacturers face various challenges, ranging from technical hurdles to organizational barriers. This article highlights the current issues in semiconductor testing and how these challenges can be addressed through innovative solutions and proven strategies.

By Thomas Seidl, Technical Sales Manager, esmo AG

During chip development, various revision stages are undergone. New developments and prototypes are produced in small batches, making them expensive and rare. The limited number of components makes the use of a high-parallel production handler impractical, as these handlers are often too expensive to procure, too complex to operate, and too time-consuming to reconfigure.

For these reasons, engineering tests are usually conducted manually, which ties up valuable employee resources and test capacities.

Additionally, modern microchips tend to get smaller, presenting extra handling challenges. One can imagine how mentally exhausting and concentration-intensive it is to correctly place and test a certain number of 1x1mm components over time, not to mention the potential for placement errors and damage.

The esmo talos automates microchip engineering test procedures easily and reliably.

Automating this process with an engineering handler, such as the esmo talos, is advantageous. An operator loads the machine with components (trays/tubes/tape), installs a component-specific conversion kit, and initiates automatic testing. With a fully tri-temp capability and an integrated Active Thermal Control System (ATC), such a handler is ideal for effortless characterization.

Switching from one package to another is possible within minutes, which is crucial when dealing with a high number of different packages. Engineers can start testing quickly without lengthy setup adjustments. The system’s high flexibility often allows the use of existing test setups, avoiding additional costs.

Automation in production
In production, the focus is on maximizing test cell utilization. Any test failure or delay is extremely costly and jeopardizes test goals. Here some common tasks and how to overcome them.

Semi-automatic board exchange via DIB changer
When a board needs to be replaced, trained personnel are usually required. The test head is undocked, manually moved outward, and returned after a successful board swap. Depending on how carefully personnel handle this process and how securely the docking solution is implemented, there can be potential tension or damage to the board or components.

An automated board exchange system from esmo can handle this process automatically. The command can come either from an operator’s push-button or directly from the test cell. The system disconnects the tester from the handler, and the board is moved outward via a drawer. It can then be easily swapped by an operator or automatically by an AGV. This ensures no damage occurs during the docking process and the connection is always secure and reliable.

Auto-setup manipulator + automated board locking
Taking automation a step further is the fully automatic docking and undocking of the tester using an automatic manipulator. A key feature is that the test head acts as the cell’s master, controlling the manipulator. If issues arise, a signal can be sent to automatically undock the test head and move it to a service position.