MIT Lincoln Laboratory invests in two AIXTRON Hyperion 300 mm systems
MIT Lincoln Laboratory has acquired two AIXTRON Hyperion systems to accelerate GaN and 2D materials research, supporting next-generation semiconductor innovation and manufacturing scale-up.
MIT Lincoln Laboratory has acquired two AIXTRON Hyperion 300 mm systems, supported by the Massachusetts Governor’s Office and the Northeast Microelectronics Coalition, to accelerate research in GaN power electronics, RF applications, and next-generation 2D materials across the wider NEMC ecosystem.
The two Hyperion systems will be installed at the Massachusetts Institute of Technology (MIT) Lincoln Laboratory and configured primarily for 200 mm wafer processing, while retaining full processing capability for substrates up to 300 mm. This flexibility will allow researchers to work across multiple wafer sizes and support the transition of promising materials and device concepts toward larger-scale manufacturing environments.
One Hyperion system will be used for GaN power and RF device development, including the exploration of novel barrier structures and advanced material concepts for next-generation high-performance devices. The second system will be dedicated to 2D materials research, targeting applications such as next-generation transistors and remote epitaxy.
“We are excited to further expand our partnership with MIT. This milestone marks another important step for AIXTRON’s technology and for the broader integration of GaN and 2D materials into silicon-based manufacturing environments,” said Dr. Felix Grawert, CEO of AIXTRON. “The Hyperion 300 mm platform combines scalable wafer capability with high process flexibility, making it well suited for MIT Lincoln Laboratory’s cutting-edge research in two of the most promising fields of advanced microelectronics. Its versatility supports the development of next-generation materials and helps create a pathway from research to future industrial application.”
This project builds on Massachusetts’ commitment to strengthening domestic semiconductor innovation through the NEMC Hub. By supporting strategic equipment investments at leading research institutions, NEMC’s SCALE Capital Program aims to accelerate breakthroughs in advanced microelectronics and foster closer collaboration between academia, government, and industry. The program is supported by funding from the Healey-Driscoll Administration and the Northeast Microelectronics Coalition Hub.
