Advanced packaging takes centre stage as AI reshapes the semiconductor value chain
As artificial intelligence reshapes semiconductor architectures and accelerates demand for advanced packaging, Yole Group and the Malaysia Semiconductor Industry Association (MSIA) will bring global market and technology intelligence to Penang through a dedicated Executive Masterclass on 4 November 2026, held as part of the Silicon Malaysia Conference 2026 (SMC2026).
The Executive Masterclass will provide semiconductor leaders and professionals with an in-depth examination of the global semiconductor outlook, heterogeneous integration and advanced packaging, and silicon photonics and photonics packaging, connecting global technology and market developments with opportunities emerging across Malaysia and the wider Asia-Pacific semiconductor ecosystem. Register today!
KEY TAKEAWAYS
Yole Group projects global semiconductor revenue to reach US$2.4 trillion by 2031, as AI reshapes semiconductor architectures and drives demand for next-generation technologies.
The advanced packaging market is projected to grow from US$55 billion in 2025 to more than US$109 billion by 2031, underscoring its increasingly critical role in AI and high-performance computing.
Malaysia is accelerating its move up the semiconductor value chain. Under the National Semiconductor Strategy (NSS), the country is targeting at least RM500 billion in investments, with advanced packaging among its strategic priorities, alongside ambitions to build Malaysian champions in design and advanced packaging.
Against this momentum, the SMC2026 Executive Masterclass comes at a timely point in Malaysia’s semiconductor journey, bringing global perspectives on advanced packaging, heterogeneous integration and silicon photonics as the country strengthens its higher-value technology capabilities. Register today!
On 4 November 2026, Yole Group and MSIA will collaborate for the first time on the SMC2026 Executive Masterclass in Penang, featuring Jean-Christophe Eloy and Yole Group analysts Claire Troadec, Yik Yee Tan and Jérôme Azémar.
FROM GLOBAL INTELLIGENCE TO INDUSTRY INSIGHT
Held on 4 November 2026 at Setia SPICE Convention Centre, Penang, the Executive Masterclass is designed to take participants beyond the headlines and provide a deeper understanding of the technologies, market dynamics and supply-chain developments shaping the semiconductor industry’s next phase.
The programme brings together Jean-Christophe Eloy, Founder & President of Yole Group, and three Yole Group analysts covering key areas of semiconductor development.
Claire Troadec will present the Global Semiconductor Outlook, examining the major market, technology and industry forces shaping the global semiconductor landscape.
Yik Yee Tan will explore Heterogeneous Integration & Advanced Packaging, including the technologies and market developments driving advanced packaging’s expanding role in the semiconductor value chain.
Jérôme Azémar will address Silicon Photonics & Photonics Packaging, examining how optical technologies are evolving to meet the rapidly increasing data-movement and connectivity requirements driven by AI and high-performance computing.
MOVING MALAYSIA FURTHER UP THE SEMICONDUCTOR VALUE CHAIN
Dato’ Seri Wong Siew Hai, President of MSIA, comments: "Malaysia has built strong semiconductor manufacturing capabilities, but our next phase of growth must be about moving further up the value chain. MSIA sees advanced packaging and IC design as critical areas in this progression, supporting our transition from ‘Made in Malaysia’ towards ‘Made by Malaysia’ and strengthening our position in the global semiconductor industry."
He adds: “This is why the Executive Masterclass, alongside SMC2026, is timely. Beyond creating business and investment opportunities, we need to equip our industry with the latest technology and market knowledge, while addressing the capabilities and talent gaps ahead. For the first time, MSIA is collaborating with Yole Group to bring this Masterclass to Malaysia’s semiconductor ecosystem, with participants also expected from neighbouring countries and across ASEAN. We see this as an important platform for knowledge exchange and stronger regional industry connections.”
A GLOBAL PERSPECTIVE ON THE TECHNOLOGIES SHAPING THE INDUSTRY
Jean-Christophe Eloy, Founder & President of Yole Group, adds: "AI is redrawing the entire semiconductor value chain, and advanced packaging has become its control point. Southeast Asia, and Malaysia in particular, is scaling faster than almost any region we track, which is exactly why partnering with MSIA for this Executive Masterclass matters: it puts our data-driven intelligence directly in the hands of the companies and investors shaping the region’s next capacity and technology decisions."
The Executive Masterclass will provide participants with an opportunity to engage directly with Yole Group’s experts on the technologies, markets and industry developments covered throughout the programme. The full agenda, speaker line-up and session details are now available. Participants can discover the programme and register for SMC2026 and the Executive Masterclass.
