News Article

Akustica Announces Innovation In Single Chip Microphones

Akustica, microelectromechanical systems (MEMS) technology manufacturer, announced availability of Akustica Microphone Chips, single-chip microphones to the market.
Akustica, microelectromechanical systems (MEMS) technology manufacturer, announced availability of Akustica Microphone Chips, single-chip microphones to the market. The
Akustica microphone chips are small, thin, light devices designed to replace the Electret Condenser Microphone (ECM), a fifty-year old technology that has been used in billions of portable electronic devices—while remaining fundamentally unchanged. The ECM, however, is limited by a number of acoustic issues: From RF noise, environmental noise, and mechanical/electromagnetic noise, the ECM cannot be used to easily eliminate all this mechanical and ambient noise—creating a number of pain points for millions of users of mobile phones, laptop computers and other digital media devices.

As a silicon microphone, Akustica's Microphone Chips are not prone to the same degree of noise from any of these sources—thereby enabling superior acoustic environments.
Akustica's Microphone Chips also offer numerous benefits to consumer electronics manufacturers. Because of their small size and surface-mountable design, Akustica's Microphone Chips are ideally suited to space-constrained consumer electronics devices that are manufactured in high volumes.

As a MEMS device manufactured using standard Complementary Metal Oxide Semiconductor (CMOS) processes, Akustica's Microphone Chips can be manufactured in quantity, with guaranteed uniformity, by existing CMOS foundries—rather than by dedicated MEMS foundries. Easier manufacturing increases access to the chips, lowering costs.
“With the consumer electronics industry recognising the demand for improved voice input quality, our launch of the world's first single-chip microphones could not come at a better time,” said Jim Rock, co-founder and CEO, Akustica, Inc. “On the one hand, we are mainstreaming MEMS devices with our Microphone Chips for a broad consumer audience. On the other, we are helping manufacturers of laptop PCs, mobile phones and other digital media devices to overcome the acoustic problems that have seriously limited the widespread adoption of VoIP and other voice-based applications in the past.”
Yole Développement, industry analysts closely following this market, forecasts significant growth for the silicon microphone market, projecting an increase from 100 million units in 2005 to a TAM of 800 million units by 2010. “The MEMS industry is changing: The winning companies are delivering devices with embedded functionality. Featuring small size and easier integration, these devices also leverage the benefits of the semiconductor infrastructure in terms of manufacturing and cost structure. Companies such as Akustica are using this model to pave the way to high-volume applications,” said J-C Eloy, general manager of Yole Développement.

Xponent ramps to meet demand by outsourcing silicon wafer fabrication to IMT

Xponent Photonics, technology innovator of FTTx optical components, announced that it has begun producing production volumes of Silicon Planar Lightwave Circuits (PLCs) at Innovative Micro Technology (IMT). IMT will produce the entire palette of PLCs, microfilters and support chips at its state-of-the-art MEMs fabrication facilities in Santa Barbara, CA.
"This announcement is the culmination of nearly a year's worth of effort to put Xponent's Surface Mount Photonic platform into a merchant silicon foundry," said Jeffrey S. Rittichier, Xponent President and CEO. "IMT is one of the leading producers of MEMs Silicon and is ideally suited to manufacturing our product and for handling our anticipated large production volumes. The move to 6" wafers will significantly increase our capacity, reduce our fixed costs and allow us to extend our leadership position in PLC-based optical components."
"We are thrilled to have Xponent as a customer," remarked John Foster, President and CEO of IMT. "Xponent's leading edge PLC technology is a perfect fit for our capabilities, and they require a manufacturing partner with IMT's skill set and fab capacity to support their growth. We are looking forward to working with Xponent to supply the telecom industry. "

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.


U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Will Future Soldiers Be Made Of Semiconductor?
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Changes In The Management Board Of 3D-Micromac AG
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
AP&S Expands Management At Beginning Of 2021
New Plant To Manufacture Graphene Electronics
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
DISCO's Completion Of New Building At Nagano Works Chino Plant
EV Group Establishes State-of-the-art Customer Training Facility
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Cadence Announces $5M Endowment To Advance Research
Onto Innovation Announces New Inspection Platform
SUSS MicroTec Opens New Production Facility In Taiwan
ASML Reports €14.0 Billion Net Sales
Panasonic Microelectronics Web Seminar
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
TEL Introduces Episode UL As The Next Generation Etch Platform

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
{taasPodcastNotification} Array
Live Event