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AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Will Future Soldiers Be Made Of Semiconductor?
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Panasonic Microelectronics Web Seminar
AP&S Expands Management At Beginning Of 2021
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
TEL Introduces Episode UL As The Next Generation Etch Platform
EV Group Establishes State-of-the-art Customer Training Facility
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
SUSS MicroTec Opens New Production Facility In Taiwan
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Cadence Announces $5M Endowment To Advance Research
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
ASML Reports €14.0 Billion Net Sales
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Changes In The Management Board Of 3D-Micromac AG
Onto Innovation Announces New Inspection Platform
New Plant To Manufacture Graphene Electronics
DISCO's Completion Of New Building At Nagano Works Chino Plant
GOODFELLOW Confirms Membership In The BSI UK Graphene Group

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