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Danish electronics packaging company funded for expansion in LED, MEMS markets

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Danish-German technology company Hymite A/S, has announced closure of its Series Preferred B financing round totalling € 9.0 million (DKK 70 million) by a European consortium of VCs consisting of TVM Capital (Germany), InnovationsKapital (Sweden), Dansk Kapitalanlæg, Vaekstfonden, and IVS (all Denmark).
Danish-German technology company Hymite A/S, has announced closure of its Series Preferred B financing round totalling € 9.0 million (DKK 70 million) by a European consortium of VCs consisting of TVM Capital (Germany), InnovationsKapital (Sweden), Dansk Kapitalanlæg, Vaekstfonden, and IVS (all Denmark). “High-brightness LEDs have become one of our sweet spots – for LEDs to penetrate into markets where today traditional evanescent light bulbs dominate, output power per watt needs to increase to 70 to 80 lumens/watt. We help to achieve that by providing a package that efficiently removes the heat from the chip so it can operate at higher currents and lower junction temperatures, thus increasing output and extending lifetime,” said Jochen Kuhmann, CTO and founder.” “New requirements from the markets such as smaller footprint and higher performance are bringing business in our direction. Wafer level packaging is a clear industry trend and we are supporting this with a low-cost, reliable solution that adds value to the customers,” said Claus Jørgen Nielsen, chief executive officer, Hymite A/S. "Miniaturization and integration possibilities using silicon wafer level packaging goes far beyond the limits set by traditional packaging technologies," said Hans-Guenther Schreck, general partner with TVM Capital. “We are convinced that silicon-based wafer level packaging is the solution for MEMS, electronics and optoelectronics products, since simplicity, size reduction and integration equals cost reduction.” "We are extremely pleased with Hymite’s progress over the past two years,” said Jimmy Fussing Nielsen, partner with Vækstfonden.”
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